31.190 - Electronic component assemblies
Showing 17–32 of 130 results
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IEC PAS 62878-2-5:2015
Device embedded substrate – Guidelines – Data format Published By Publication Date Number of Pages…
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IEC PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes…
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IEC 62878-2-602:2021
Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method…
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IEC 62878-1:2019
Device embedding assembly technology – Part 1: Generic specification for device embedded substrates Published By…
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IEC 62878-2-5:2019
Technologie d’ensemble avec appareil(s) intégré(s) – Partie 2-5: Lignes directrices – Mise en œuvre d’un…
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IEC 62878-1-1:2015
Device embedded substrate – Part 1-1: Generic specification – Test methods Published By Publication Date…
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IEC 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part…
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IEC 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part…
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IEC 62739-1:2013
Méthode d’essai de l’érosion de l’équipement de brasage à la vague utilisant un alliage à…
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IEC 62421:2007
Electronics assembly technology – Electronic modules Published By Publication Date Number of Pages IEC 2007-08-24…
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IEC 62137:2004
Essais d’environnement et d’endurance – Méthodes d’essai pour les cartes à montage en surface de…
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IEC 62137-4:2014
Technique d’assemblage des composants électroniques – Partie 4 : méthodes d’essais d’endurance des joints brasés…
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IEC 62137-3:2011
Electronics assembly technology – Part 3: Selection guidance of environmental and endurance test methods for…
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IEC 62137-1-5:2009
Technologie du montage en surface – Méthodes d’essais d’environnement et d’endurance des joints brases montes…
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IEC 62137-1-4:2009
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint –…
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IEC 62137-1-3:2008
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint –…