This document is an annex to SAE Technical Report SSB-1 (the latest revision).

This document provides reference information and guidance concerning methods used by the semiconductor industry and original equipment manufacturers related to radiation hardness assessments. This document is broken into three primary sections. Section 3 discusses part characterization with focus on selection criteria and acceptance testing. Section 4 discusses design hardening for piece parts with focus on degraded design limits and radiation design margin. The last section, Section 5, of this report is on hardness assurance inspection and test. This section discusses total ionizing dose, displacement damage and single event effects testing in detail.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision).

This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision).

The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.

This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

This document covers the requirements for transceiver qualification. Requirements stated in this document will provide a minimum standard level of performance for the CAN transceiver in the IC to which all compatible transceivers shall be designed. No other features in the IC are tested or qualified as part of this recommended practice. This will assure robust serial data communication among all connected devices, regardless of supplier.

The goal of SAE J2962-2 is to commonize approval processes of CAN transceivers across OEMs.

The intended audience includes, but is not limited to, CAN transceiver suppliers, component release engineers, and vehicle system engineers.

This document covers the requirements for transceiver qualification. Requirements stated in this document will provide a minimum standard level of performance for the LIN transceiver block in the IC to which all compatible transceivers shall be designed. No other features in the IC are tested or qualified as part of this recommended practice. This will assure robust serial data communication among all connected devices regardless of supplier.

The goal of SAE J2962-1 is to commonize approval processes of LIN transceivers across OEMs.

The intended audience includes, but is not limited to, LIN transceiver suppliers, component release engineers, and vehicle system engineers.

This SAE Recommended Practice covers the requirements for ethernet physical layer (PHY) qualification. Requirements stated in this document provide a minimum standard level of performance for the PHY in the IC to which all compatible ethernet communications PHY shall be designed. When the communications chipset is an ethernet switch with an integrated automotive PHY (xBASE-T1), then the testing shall include performance for all switch PHY ports as well as each controller interface. No other features in the IC are tested or qualified as part of this SAE Recommended Practice. This assures robust serial data communication among all connected devices regardless of supplier.

The goal of SAE J2962-3 is to commonize approval processes of ethernet PHYs across OEMs.

The intended audience includes, but is not limited to, ethernet PHY suppliers, component release engineers, and vehicle system engineers.

This document covers the requirements for SAE implementations based on LIN 2.0. Requirements stated in this document will provide a minimum standard level of performance to which all compatible systems, design and development tools, software, ECUs and media shall be designed. This will assure consistent and unambiguous serial data communication among all connected devices regardless of supplier.

This document may be referenced by any vehicle OEM component technical specification that describes any given ECU in which the single wire data link controller and physical layer interface is located.

The intended audience includes, but is not limited to, ECU suppliers, LIN controller suppliers, LIN transceiver suppliers, component release engineers and vehicle system engineers.

This document covers the tests to be performed on all SAE J2602-1 defined Master and Slave nodes. Tests described in this document will ensure a minimum standard level of performance to which all compatible Electronic Control Unit (ECUs) and media shall be designed. This will assure full serial data communication among all connected devices regardless of supplier.

The goal of SAE J2602-2 is to improve the interoperability and interchangeability of LIN devices within a network by verifying the devices pass a minimum set of tests.

To allow for easy cross-reference, this document is arranged such that the conformance test for a given section in SAE J2602-1 is in the same section in SAE J2602-2.

This document is to be referenced by the particular vehicle Original Equipment Manufacturer (OEM) component technical specification that describes any given ECU in which the LIN data link controller and physical layer interface is located. Primarily, the performance of the physical layer is specified in this document. ECU environmental and other requirements, when provided in the component technical specification, shall supersede the requirements of this document.

The intended audience includes, but is not limited to, ECU suppliers, LIN controller suppliers, LIN transceiver suppliers, component release engineers and vehicle system engineers.

This SAE Recommended Practice will define the Physical Layer and portions of the Data Link Layer of the Open Systems Interconnection model (ISO 7498) for a 500 kbps arbitration bus with CAN FD Data at 5 Mbps High-Speed CAN (HSC) protocol implementation. Both ECU and media design requirements for networks will be specified. Requirements will primarily address the CAN physical layer implementation.

Requirements will focus on a minimum standard level of performance from the High-Speed CAN (HSC) implementation. All ECUs and media shall be designed to meet certain component level requirements in order to ensure the HSC implementation system level performance at 500 kbps arbitration bus with CAN FD Data at 5 Mbps. The minimum performance level shall be specified by system level performance requirements or characteristics described in detail in Section 6 of this document.

This document is designed such that if the Electronic Control Unit (ECU) requirements defined in Section 6 are met, then the system level attributes should be obtainable.

This document will address only requirements which may be tested at the ECU and media level. No requirements which apply to the testing of the HSC implementation as integrated into a vehicle are contained in this document. However, compliance with all ECU and media requirements will increase the possibility of communication compatibility between separately procured components and will greatly simplify the task of successfully integrating a HSC communication system in a vehicle.