Guidance to control and mitigate risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic assemblies is provided. A template for developing a Foreign Object Debris (FOD) Control Plan is included.

This document summarizes the IPC position on the subject of "halogen-free" materials for the electronics industry. Its initial release was developed over a period of three years and this revision is also the culmination of another three years of work by a team representing every level of the electronics supply chain. This document is applicable to materials for interconnecting electronics including, but not limited to, copper-clad laminates and prepregs, resin coated copper foils, flexible materials and solder masks. This document reflects the state of the information and technology as of May 2007.

Guidance to reduce and control exposure to environmental conditions and contamination that promote the development of White Plague is provided in this document. A template for developing a White Plague Control Plan (WPCP) is included.

Guidance to reduce and control exposure to environmental conditions and contamination that promote the development of Red Plague is provided in this document. A template for developing a Red Plague Control Plan (RPCP) is included.

This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.

IPC-WP-023 white paper provides an investigation of these issues using data collected from multiple printed board manufacturers and research conducted by the author.

IPC-WP-019B a revised white paper provides an overview of ionic cleanliness requirements, providing examples of tests and requirements for acceptability from a residue/cleanliness standpoint. The history of ROSE testing is also provided, with explanations of the shortcomings of that testing.

The IPC-WP-021 white paper considers conformal coatings, like many high-performance materials, have evolved considerably since the 1990s. New coatings, such as fluoropolymers or hybrid coatings, have come on the market, many of which offer superior protection characteristics, but do not fit into the existing classifications of either MIL-I-46058 or IPC-CC-830. The IPC-WP-021 white paper discusses how to add new classes of coatings to the IPC-CC-830 specification, without eliminating the historical relationship to MIL-I-46058. The new classes will be added to IPC-CC-830, Revision C.

As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries. This working paper is a summary of the predominant research on tin whiskers as of September, 2008. 15 pages. Released March 2009.

IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized.

IPC-TR-587 is a report outlining an IPC study of major conformal coating types, coating application techniques, and coating cure technologies, characterizing the final film thickness on common component surfaces.