{"id":111080,"date":"2024-10-18T16:05:31","date_gmt":"2024-10-18T16:05:31","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/ieee-1301-2-1993\/"},"modified":"2024-10-24T22:00:14","modified_gmt":"2024-10-24T22:00:14","slug":"ieee-1301-2-1993","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/ieee\/ieee-1301-2-1993\/","title":{"rendered":"IEEE 1301.2 1993"},"content":{"rendered":"
New IEEE Standard – Inactive – Withdrawn. Administratively withdrawn January 2007 Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
1<\/td>\n | Title Page <\/td>\n<\/tr>\n | ||||||
3<\/td>\n | Introduction Participants <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 1. Overview 1.1 Scope and purpose 1.2 Background <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 1.3 Implementation 1.4 Dimensions <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 1.5 Coordination dimensions 1.6 Connector-related parameters 1.7 Environmental requirements <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 2. References <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 3. Special word usage, definitions, and abbreviations 3.1 Special word usage 3.2 Definitions 3.3 Abbreviations <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4. Dimensional nomenclature 5. Interoperability 5.1 Overall cabinet and rack sizes 5.2 Mounting an IEC 297-3 (or IEEE 1101.1) subrack, rack, or cabinet panel in an IEEE 1301 cabinet or rack, and the reverse <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 5.3 Subracks <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 5.4 Plug-in units <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 6. Cabinets and racks 6.1 Cabinet or rack <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 6.2 Rack and cabinet front panels 7. Subracks 7.1 Subrack size selection 7.2 Printed board guide <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 7.3 Front panel 7.4 Thermal management considerations 8. Backplane 8.1 Height 8.2 Width <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | 8.3 Thickness 8.4 Bow allowance 8.5 Stiffeners 8.6 Plug-in unit size or pitch 8.7 Power distribution requirements 8.8 Backplane connector requirements 9. Plug-in unit 9.1 Plug-in unit requirements <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | 9.2 Printed board 9.3 Front panel attachment option 9.4 Indicators and switches <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | 9.5 Alignment pin 10. Connector requirements 10.1 Connector type\/pin pitch 10.2 Backplane connectors 10.3 Plug-in unit connectors (used only with box- or frame-type plug-in units) 10.4 Printed board connectors 10.5 Front mounted l\/O connectors 11. Specific example 11.1 Overview <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | 11.2 Profile B market segment 11.3 Equipment practice 11.4 Plug-in unit size considerations 11.5 Plug-in unit pitch and I\/O direction <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | 11.6 Plug-in unit printed board thickness 11.7 Allowance for components on side 2 of the printed board 11.8 Plug-in unit ESD protection 11.9 Plug-in unit guide groove width definition 11.10 Front panel and VDE\/FCC considerations 11.11 Backplane to plug-in unit connector choice <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | 11.12 Tolerance and alignment requirements 11.13 Thermal considerations 11.14 Safety considerations <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" IEEE Recommended Practices for the Implementation of a Metric Equipment Practice (IEEE Std 1301-1991)<\/b><\/p>\n |