{"id":233919,"date":"2024-10-19T15:15:21","date_gmt":"2024-10-19T15:15:21","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-iec-63011-32018\/"},"modified":"2024-10-25T09:46:34","modified_gmt":"2024-10-25T09:46:34","slug":"bs-iec-63011-32018","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-iec-63011-32018\/","title":{"rendered":"BS IEC 63011-3:2018"},"content":{"rendered":"

IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC. Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.  <\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
4<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
5<\/td>\nFOREWORD <\/td>\n<\/tr>\n
7<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
8<\/td>\n1 Scope
2 Normative references
Figures
Figure 1 \u2013 Reference of a multi-chip interconnect system <\/td>\n<\/tr>\n
9<\/td>\n3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
3.2 Abbreviated terms
4 Measurement conditions to specify TSV characteristics
4.1 Supply chain and TSV circuit model
Figure 2 \u2013 3-D IC Supply chain model <\/td>\n<\/tr>\n
10<\/td>\n4.2 Reference model of TSV electrical characteristics
Figure 3 \u2013 TSV electrical characteristic model <\/td>\n<\/tr>\n
11<\/td>\n4.3 Measurement conditions to specify TSV electrical characteristics
4.3.1 General
4.3.2 Resistance measurement
Tables
Table 1 \u2013 Policy for model standardization <\/td>\n<\/tr>\n
12<\/td>\n4.3.3 Capacitance measurement
Figure 4 \u2013 Resistance measurement method
Figure 5 \u2013 Capacitance measurement method <\/td>\n<\/tr>\n
13<\/td>\nFigure 6 \u2013 Measurement conditions to specify TSV electrical characteristicswhen substrate is not connected to power supply <\/td>\n<\/tr>\n
14<\/td>\nAnnex A (informative)Explanatory note
A.1 Purpose of establishment
A.2 Reference dimension of the TSV model
Table A.1 \u2013 Parameters and reference values of the TSV model <\/td>\n<\/tr>\n
15<\/td>\nA.3 Other considerations for implementation
A.3.1 General
A.3.2 Keep out zone
Figure A.1 \u2013 Structure of the TSV model <\/td>\n<\/tr>\n
16<\/td>\nFigure A.2 \u2013 KOZ definition
Table A.2 \u2013 Parameters affecting KOZ <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Integrated circuits. Three dimensional integrated circuits – Model and measurement conditions of through-silicon via<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2019<\/td>\n18<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":233927,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-233919","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/233919","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/233927"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=233919"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=233919"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=233919"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}