IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.<\/p>\n
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| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 4<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 4 Die alignment during three dimensional integration 4.1 Alignment during stacking 4.2 Alignment maintenance during die bonding Figures Figure 1 \u2013 Procedure of alignment of dies during die stacking <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | Figure 2 \u2013 Misalignment sensing and compensation by aligner Figure 3 \u2013 Adjustment for translational misalignment <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 4.3 Alignment measurement after die stacking 5 Alignment procedure 5.1 Initial die stacking 5.2 Final alignment 5.3 Assessment of alignment Figure 4 \u2013 Final alignment of vertical interconnects betweenthe adjacent layers of dies <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | Annex A (informative)Alignment examples A.1 Alignment maintenance using capacitive coupling Figure A.1 \u2013 Capacitive coupling between two misaligned wires with different widths <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | Figure A.2 \u2013 Relative capacitance with misalign and metal width Figure A.3 \u2013 Multiple narrow wires Figure A.4 \u2013 2-D alignment key in (top) mesh type and (bottom) conjugate X- and Y-direction detectors <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | A.2 Alignment maintenance using inductive coupling Figure A.5 \u2013 S12 roll-off with misalignment (M) for at H = 10 \u00b5m, ratio = 0,1, f = 0,01 GHz, and T = 0,5 \u00b5m Table A.1 \u2013 Alignment key dimensions <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | A.3 Alignment measurement after stacking is completed Figure A.6 \u2013 Alignment keys for inductive coupling alignment detector when the electricity in the upper die is (left) available and (right) unavailable Figure A.7 \u2013 Alignment measurement keys of (top)aligned and (below) misaligned stacking <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Integrated circuits. Three dimensional integrated circuits – Alignment of stacked dies having fine pitch interconnect<\/b><\/p>\n |