This part of IEC 61967 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s).<\/p>\n
The object of this document is to describe general conditions in order to establish a uniform testing environment and to obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are described. Deviations from this document are noted explicitly in the individual test report. The measurement results can be used for comparison or other purposes.<\/p>\n
Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit.<\/p>\n
The applicable frequency range is described in each part of IEC 61967.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4 Test conditions 4.1 General 4.2 Ambient conditions 4.2.1 General <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 4.2.2 Ambient temperature 4.2.3 Ambient RF field strength 4.2.4 Other ambient conditions 4.2.5 IC stability over time 5 Test equipment 5.1 General 5.2 Shielding 5.3 RF measuring instrument 5.3.1 General 5.3.2 Measuring receiver Tables Table 1 \u2013 Measuring receiver bands and resolution bandwidth (RBW) default settings <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 5.3.3 Spectrum analyser 5.3.4 Other RBW for narrowband emissions 5.3.5 Emission type, detector type and sweep speed 5.3.6 Video bandwidth 5.3.7 Verification of calibration for the RF measuring instrument Table 2 \u2013 Spectrum analyser bands and RBW default settings <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 5.4 Frequency range 5.5 Preamplifier or attenuator 5.6 System gain 5.7 Other components 6 Test set-up 6.1 General 6.2 Test circuit board 6.3 IC pin loading <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 6.4 Power supply requirements \u2013 Test board power supply 6.5 IC specific considerations 6.5.1 IC supply voltage 6.5.2 IC decoupling 6.5.3 Activity of IC 6.5.4 Guidelines regarding IC operation Table 3 \u2013 IC pin loading recommendations <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | 7 Test procedure 7.1 Ambient RF noise check 7.2 Operational check 7.3 Specific procedures 8 Test report 8.1 General 8.2 Ambient RF noise 8.3 Description of device <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 8.4 Description of set-up 8.5 Description of software 8.6 Data presentation 8.6.1 General 8.6.2 Graphical presentation 8.6.3 Measurement data 8.6.4 Data processing 8.7 RF emission limits 8.8 Interpretation of results 8.8.1 Comparison between IC(s) using the same test method 8.8.2 Comparison between different test methods 8.8.3 Correlation to module test methods <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | Annex A (informative) Test method comparison tables Table A.1 \u2013 Conducted emission <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | Table A.2 \u2013 Radiated emission <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | Annex B (informative) Flow chart of a counter test code Figure B.1 \u2013 Test code flow chart <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | Annex C (informative) Description of worst-case application software Figures <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | Annex D (informative) General test board description D.1 General D.2 Board description \u2013 Mechanical D.3 Board description \u2013 Electrical D.4 Ground planes Table D.1 \u2013 Position of vias over the board <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | D.5 Package pins D.5.1 General D.5.2 DIL packages D.5.3 SOP, PLCC, QFP packages D.5.4 PGA packages D.5.5 BGA packages D.6 Via diameters D.7 Via distance D.8 Additional components D.9 Supply decoupling D.9.1 General <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | D.9.2 IC decoupling capacitors D.9.3 Power supply decoupling for the test board D.10 I\/O load <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | Figure D.1 \u2013 Example of an emission test board <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Integrated circuits. Measurement of electromagnetic emissions – General conditions and definitions<\/b><\/p>\n |