{"id":234088,"date":"2024-10-19T15:16:03","date_gmt":"2024-10-19T15:16:03","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-60749-182019\/"},"modified":"2024-10-25T09:47:43","modified_gmt":"2024-10-25T09:47:43","slug":"bs-en-iec-60749-182019","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-60749-182019\/","title":{"rendered":"BS EN IEC 60749-18:2019"},"content":{"rendered":"

IEC 60749-18:2019 is available as \/2 which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 60749-18:2019 provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 (60Co) gamma ray source. Other suitable radiation sources can be used. This document addresses only steady-state irradiations, and is not applicable to pulse type irradiations. It is intended for military- and aerospace-related applications. It is a destructive test. This edition includes the following significant technical changes with respect to the previous edition: – updates to subclauses to better align the test method with MIL-STD 883J, method 1019, including the use of enhanced low dose rate sensitivity (ELDRS) testing; – addition of a Bibliography, which includes ASTM standards relevant to this test method.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nNational foreword <\/td>\n<\/tr>\n
5<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
7<\/td>\nFOREWORD <\/td>\n<\/tr>\n
9<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
11<\/td>\n4 Test apparatus
4.1 Choice of apparatus
4.2 Radiation source
4.3 Dosimetry system
4.4 Electrical test instruments
4.5 Test circuit board(s) <\/td>\n<\/tr>\n
12<\/td>\n4.6 Cabling
4.7 Interconnect or switching system
4.8 Environmental chamber
4.9 Irradiation temperature chamber
5 Procedure
5.1 Test plan
5.2 Sample selection and handling <\/td>\n<\/tr>\n
13<\/td>\n5.3 Burn-in
5.4 Dosimetry measurements
5.5 Lead\/aluminium (Pb\/Al) container
5.6 Radiation level(s)
5.7 Radiation dose rate
5.7.1 Radiation dose rate determination <\/td>\n<\/tr>\n
14<\/td>\n5.7.2 Condition A
5.7.3 Condition B
5.7.4 Condition C
5.7.5 Condition D
5.7.6 Condition E
5.8 Temperature requirements
5.8.1 Room temperature radiation
5.8.2 Elevated temperature irradiation <\/td>\n<\/tr>\n
15<\/td>\n5.8.3 Cryogenic temperature irradiation
5.9 Electrical performance measurements
5.10 Test conditions
5.10.1 Choice of test conditions
5.10.2 In-flux testing
5.10.3 Remote testing <\/td>\n<\/tr>\n
16<\/td>\n5.10.4 Bias and loading conditions
5.11 Post-irradiation procedure <\/td>\n<\/tr>\n
17<\/td>\n5.12 Extended room temperature annealing test
5.12.1 Choice of annealing test
5.12.2 Need to perform an extended room temperature annealing test
5.12.3 Extended room temperature annealing test procedure <\/td>\n<\/tr>\n
18<\/td>\n5.13 MOS accelerated annealing test
5.13.1 Choice of MOS accelerated annealing test
5.13.2 Need to perform accelerated annealing test <\/td>\n<\/tr>\n
19<\/td>\n5.13.3 Accelerated annealing test procedure
5.14 Test procedure for bipolar and BiCMOS linear or mixed signal devices with intended application dose rates less than 0,5\u00a0Gy(Si)\/s
5.14.1 Need to perform ELDRS testing <\/td>\n<\/tr>\n
20<\/td>\n5.14.2 Determination of whether a part exhibits ELDRS
5.14.3 Characterization of ELDRS parts to determine the irradiation conditions for production or lot acceptance testing <\/td>\n<\/tr>\n
21<\/td>\n5.14.4 Low dose rate or elevated temperature irradiation test for bipolar or BiCMOS linear or mixed-signal devices
5.15 Test report
6 Summary <\/td>\n<\/tr>\n
22<\/td>\nFigure 1 \u2013 Flow diagram for ionizing radiation test procedure for MOS and digital bipolar devices <\/td>\n<\/tr>\n
23<\/td>\nFigure 2 \u2013 Flow diagram for ionizing radiation test procedure for bipolar (or BiCMOS) linear or mixed-signal devices <\/td>\n<\/tr>\n
24<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Semiconductor devices. Mechanical and climatic test methods – Ionizing radiation (total dose)<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2019<\/td>\n26<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":234091,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-234088","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/234088","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/234091"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=234088"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=234088"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=234088"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}