{"id":234088,"date":"2024-10-19T15:16:03","date_gmt":"2024-10-19T15:16:03","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-60749-182019\/"},"modified":"2024-10-25T09:47:43","modified_gmt":"2024-10-25T09:47:43","slug":"bs-en-iec-60749-182019","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-60749-182019\/","title":{"rendered":"BS EN IEC 60749-18:2019"},"content":{"rendered":"
IEC 60749-18:2019 is available as \/2 which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 60749-18:2019 provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 (60Co) gamma ray source. Other suitable radiation sources can be used. This document addresses only steady-state irradiations, and is not applicable to pulse type irradiations. It is intended for military- and aerospace-related applications. It is a destructive test. This edition includes the following significant technical changes with respect to the previous edition: – updates to subclauses to better align the test method with MIL-STD 883J, method 1019, including the use of enhanced low dose rate sensitivity (ELDRS) testing; – addition of a Bibliography, which includes ASTM standards relevant to this test method.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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2<\/td>\n | National foreword <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4 Test apparatus 4.1 Choice of apparatus 4.2 Radiation source 4.3 Dosimetry system 4.4 Electrical test instruments 4.5 Test circuit board(s) <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4.6 Cabling 4.7 Interconnect or switching system 4.8 Environmental chamber 4.9 Irradiation temperature chamber 5 Procedure 5.1 Test plan 5.2 Sample selection and handling <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 5.3 Burn-in 5.4 Dosimetry measurements 5.5 Lead\/aluminium (Pb\/Al) container 5.6 Radiation level(s) 5.7 Radiation dose rate 5.7.1 Radiation dose rate determination <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 5.7.2 Condition A 5.7.3 Condition B 5.7.4 Condition C 5.7.5 Condition D 5.7.6 Condition E 5.8 Temperature requirements 5.8.1 Room temperature radiation 5.8.2 Elevated temperature irradiation <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 5.8.3 Cryogenic temperature irradiation 5.9 Electrical performance measurements 5.10 Test conditions 5.10.1 Choice of test conditions 5.10.2 In-flux testing 5.10.3 Remote testing <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 5.10.4 Bias and loading conditions 5.11 Post-irradiation procedure <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 5.12 Extended room temperature annealing test 5.12.1 Choice of annealing test 5.12.2 Need to perform an extended room temperature annealing test 5.12.3 Extended room temperature annealing test procedure <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 5.13 MOS accelerated annealing test 5.13.1 Choice of MOS accelerated annealing test 5.13.2 Need to perform accelerated annealing test <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 5.13.3 Accelerated annealing test procedure 5.14 Test procedure for bipolar and BiCMOS linear or mixed signal devices with intended application dose rates less than 0,5\u00a0Gy(Si)\/s 5.14.1 Need to perform ELDRS testing <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 5.14.2 Determination of whether a part exhibits ELDRS 5.14.3 Characterization of ELDRS parts to determine the irradiation conditions for production or lot acceptance testing <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 5.14.4 Low dose rate or elevated temperature irradiation test for bipolar or BiCMOS linear or mixed-signal devices 5.15 Test report 6 Summary <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Figure 1 \u2013 Flow diagram for ionizing radiation test procedure for MOS and digital bipolar devices <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Figure 2 \u2013 Flow diagram for ionizing radiation test procedure for bipolar (or BiCMOS) linear or mixed-signal devices <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Mechanical and climatic test methods – Ionizing radiation (total dose)<\/b><\/p>\n |