IEC 60068-3-13:2016 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1, which defines requirements to the specification of surface mounting components. This first edition cancels and replaces IEC 60068-2-44:1995 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: – information for lead-free solders are added; – technical update and restructuring.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 52<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 54<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 56<\/td>\n | 1 Scope 2 Normative references 3 Terms, definitions and abbreviations 3.1 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 57<\/td>\n | 3.2 Abbreviations 4 Overview 4.1 Factors influencing the formation and reliability of solder joints (ability to be soldered) <\/td>\n<\/tr>\n | ||||||
| 58<\/td>\n | 4.2 Physics of surface wetting Figures Figure 1 \u2013 Sessile drop of solder on oxidised copper <\/td>\n<\/tr>\n | ||||||
| 59<\/td>\n | Figure 2 \u2013 Sessile drop of solder plus flux on clean copper Figure 3 \u2013 Sessile drop equilibrium forces <\/td>\n<\/tr>\n | ||||||
| 60<\/td>\n | 4.3 Quality and reliability of solder joints 5 Component soldering \u2013 Processes 5.1 General considerations 5.1.1 Components’ ability to be soldered <\/td>\n<\/tr>\n | ||||||
| 62<\/td>\n | 5.1.2 Soldering processes 5.1.3 Soldering defects 5.1.4 Geometrical factors which may influence the soldering result 5.1.5 Process factors 5.1.6 Material factors Figure 4 \u2013 Typical soldering processes <\/td>\n<\/tr>\n | ||||||
| 63<\/td>\n | 5.2 Solder 5.3 Grouping of soldering conditions 5.4 Ability to be soldered 5.5 Moisture sensitivity of components Tables Table 1 \u2013 Solder process groups <\/td>\n<\/tr>\n | ||||||
| 64<\/td>\n | 5.6 Relation between storage time\/storage conditions and solderability 5.6.1 Natural and accelerated ageing 5.6.2 Oxidation 5.6.3 Growth of intermetallic layers 5.6.4 Effect of ageing to wetting characteristics <\/td>\n<\/tr>\n | ||||||
| 65<\/td>\n | 5.6.5 Test conditions for accelerated ageing <\/td>\n<\/tr>\n | ||||||
| 66<\/td>\n | 5.7 Place of soldering tests in testing <\/td>\n<\/tr>\n | ||||||
| 67<\/td>\n | 6 Soldering tests 6.1 General <\/td>\n<\/tr>\n | ||||||
| 68<\/td>\n | 6.2 Solder 6.3 Fluxes 6.4 Test equipment 6.5 Evaluation methods 6.5.1 Criteria for visual inspection <\/td>\n<\/tr>\n | ||||||
| 69<\/td>\n | 6.5.2 Criteria for quantitative evaluation of the wetting characteristic 6.5.3 Special cases 6.6 Acceptance criteria 7 Soldering tests \u2013 Methods 7.1 General principles 7.2 Survey of test methods <\/td>\n<\/tr>\n | ||||||
| 71<\/td>\n | Figure 5 \u2013 Soldering tests for devices with leads <\/td>\n<\/tr>\n | ||||||
| 72<\/td>\n | 7.3 Bath test Figure 6 \u2013 Soldering tests for SMDs <\/td>\n<\/tr>\n | ||||||
| 73<\/td>\n | 7.4 Reflow test 7.4.1 With\/without solder land 7.4.2 Selection of solder paste (flux system and activity grade) 7.5 Soldering iron test 7.6 Resistance to dissolution of metallization and soldering heat 7.6.1 General 7.6.2 Limitations <\/td>\n<\/tr>\n | ||||||
| 74<\/td>\n | 7.6.3 Choice of severity 7.7 Wetting balance test 7.7.1 General <\/td>\n<\/tr>\n | ||||||
| 75<\/td>\n | 7.7.2 Test methods available 7.7.3 Limitations 8 Requirements and statistical character of results <\/td>\n<\/tr>\n | ||||||
| 77<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Tracked Changes. Environmental testing – Supporting documentation and guidance on Test T. Soldering<\/b><\/p>\n |