{"id":239737,"date":"2024-10-19T15:41:06","date_gmt":"2024-10-19T15:41:06","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-tr-61340-5-52018\/"},"modified":"2024-10-25T10:23:47","modified_gmt":"2024-10-25T10:23:47","slug":"bsi-pd-iec-tr-61340-5-52018","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-tr-61340-5-52018\/","title":{"rendered":"BSI PD IEC TR 61340-5-5:2018"},"content":{"rendered":"
This part of IEC 61340 discusses packaging material requirements for electrostatic discharge sensitive items (ESDS) as well as non\u2013ESDS which can apply to packaging materials such as embossed carrier tape, trays, tubes (stick magazines), rails and others used in back end line processing and parts handling where test methods described in other standards are, for the most part, inadequate. Issues related to electrostatic charge generation, electrostatic attraction and repulsion are included. The recommendations and discussions within this document can also be applicable to other types of packaging that cannot be evaluated by other means.<\/p>\n
This document discusses the issues related to<\/p>\n
technical considerations for packaging material selection and packaging system design,<\/p>\n<\/li>\n
packaging material specifications for electrostatic control,<\/p>\n<\/li>\n
existing test methods and their limitations for packaging materials,<\/p>\n<\/li>\n
suggestions for the evaluation of small dimension packaging materials, and<\/p>\n<\/li>\n
industry common practices.<\/p>\n<\/li>\n<\/ol>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 1 Scope 2 Normative references 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 3.2 Abbreviated terms <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4 Role of electrostatic protective packaging 4.1 Analysis of electrostatic risks (what can cause problems to ESDS) 4.2 Charge generation (separation) <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Figures Figure 1 \u2013 Induction charging process \u2013 Grounding a conductorin the presence of an electrical field <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Figure 2 \u2013 Second part of induction charging process Figure 3 \u2013 First discharge pulse that occurs as shown in Figure 1 b) Figure 4 \u2013 Second discharge pulse that occurs as shown in Figure 2 <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 4.3 Reduction of electrostatic charging items in the environment 4.4 Electrostatic attraction and repulsion issues <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 4.5 Dissipation of electrostatic charge 4.6 Barrier to ESD current 4.7 Protection against electrostatic fields 4.8 Chemical and outgassing issues <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 4.9 Moisture barrier 4.10 Environmental conditions affecting packaging materials 4.11 Packaging material principles 4.11.1 General 4.11.2 Low charging 4.11.3 Electrostatic charge dissipation <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 4.11.4 Conductive materials 4.11.5 Electrostatic field shielding 4.11.6 Electrostatic discharge shielding 5 Types of material 5.1 Filled polymers <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 5.2 Intrinsically conductive or dissipative 5.3 Surface coated 5.4 Antistat treated 5.5 Anodized materials (e.g. boats used inside automated handlers, metal tubes) 5.6 Material processing 5.6.1 Vacuum forming 5.6.2 Injection moulding <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 5.6.3 Embossing 5.6.4 Vacuum vapour deposition 5.6.5 Surface coating 5.6.6 Lamination 6 Existing standards for packaging materials 6.1 IEC 61340-5-3 6.2 ANSI\/ESD S541 <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 6.3 Military standards and other documents related to packaging 6.3.1 General 6.3.2 MIL PRF 81705 (E) (Film) 6.3.3 MIL STD 3010 6.3.4 MIL PRF 131 7 Existing test methods for packaging materials 7.1 IEC 61340-2-1 \u2013 Ability of materials and products to dissipate static electric charge <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 7.2 IEC TR 61340-2-2 \u2013 Measurement of chargeability 7.3 IEC 61340-2-3 \u2013 Resistance and resistivity 7.4 IEC 61340-4-8 \u2013 Discharge shielding \u2013 Bags <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | 8 Choosing a packaging technology 8.1 Determining packaging material attributes 8.2 Inside an EPA 8.3 Outside an EPA or between EPAs 8.4 Evaluation of packaging system attributes 8.5 Charge dissipation test methods 8.6 Resistance measurement methods <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | 8.7 Shielding test 9 Does the packaging system meet the intended purpose? 10 New test method concepts and development plans 10.1 General Table 1 \u2013 Test methods for electrostatic protective packaging <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | 10.2 Single point probe 10.3 Parallel plates Figure 5 \u2013 Single point probe test method set-up Figure 6 \u2013 Single point probe on embossed (pocket) tape <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | 10.4 Pin-point probe 10.5 Shielding related test methods 10.6 Charge generation \u2013 Triboelectrification test methods Figure 7 \u2013 Parallel plate test method set-up <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | Figure 8 \u2013 Set-up of isolated tape reels Figure 9 \u2013 Resistance measurements \u2013 Reel to reel <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | 10.7 Triboelectric charging of cover tape Figure 10 \u2013 Charge drain test \u2013 Reel to reel Figure 11 \u2013 Cover tape evaluation concepts <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | 10.8 Discharge evaluation method 10.9 Other resistance test methods Figure 12 \u2013 Discharge evaluation method <\/td>\n<\/tr>\n | ||||||
30<\/td>\n | Annex A (informative)Packaging forms and types A.1 Packaging materials for electronic devices A.2 Embossed tape A.3 Cover tape Figure A.1 \u2013 Examples of embossed (pocket) tape <\/td>\n<\/tr>\n | ||||||
31<\/td>\n | A.4 Reel types and materials Figure A.2 \u2013 Cover tape Figure A.3 \u2013 Cover tape Figure A.4 \u2013 Cover tape Figure A.5 \u2013 Cover tape Figure A.6 \u2013 Cover tape Figure A.7 \u2013 Cover tape Figure A.8 \u2013 Cover tape <\/td>\n<\/tr>\n | ||||||
32<\/td>\n | A.5 Injection moulded trays Figure A.9 \u2013 Reels Figure A.10 \u2013 Reels Figure A.11 \u2013 Reels Figure A.12 \u2013 Reels Figure A.13 \u2013 Trays Figure A.14 \u2013 Trays Figure A.15 \u2013Trays <\/td>\n<\/tr>\n | ||||||
33<\/td>\n | A.6 Tubes and rails and other configurations of packaging materials Figure A.16 \u2013 Trays Figure A.17\u2013 Trays Figure A.18 \u2013Trays Figure A.19 \u2013 Trays Figure A.20 \u2013 Trays Figure A.21 \u2013 Trays Figure A.22 \u2013Trays Figure A.23 \u2013 Trays <\/td>\n<\/tr>\n | ||||||
34<\/td>\n | A.7 Clam shell and test socket A.8 Bags Figure A.24 \u2013 Tubes Figure A.25 \u2013 Tubes Figure A.26 Tubes Figure A.27 \u2013Clam shells <\/td>\n<\/tr>\n | ||||||
35<\/td>\n | A.9 Tote boxes and other rigid containers Figure A.28 \u2013 Static discharge shielding bag Figure A.29 Moisture barrier \u2013 Metal foil bags Figure A.30 \u2013 Moisture barrier \u2013 Metal vapour deposition Figure A.31 \u2013 Box Figure A.32 \u2013 Rigid container <\/td>\n<\/tr>\n | ||||||
36<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Electrostatics – Protection of electronic devices from electrostatic phenomena. Packaging systems used in electronic manufacturing<\/b><\/p>\n |