{"id":248376,"date":"2024-10-19T16:21:44","date_gmt":"2024-10-19T16:21:44","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-62148-212019\/"},"modified":"2024-10-25T11:31:09","modified_gmt":"2024-10-25T11:31:09","slug":"bs-en-iec-62148-212019","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-62148-212019\/","title":{"rendered":"BS EN IEC 62148-21:2019"},"content":{"rendered":"

This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.<\/p>\n

The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
5<\/td>\nAnnex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
8<\/td>\nFOREWORD <\/td>\n<\/tr>\n
10<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
11<\/td>\n4 Terminal position numbering
5 Code of package nominal dimensions
6 Symbols and drawings <\/td>\n<\/tr>\n
12<\/td>\nFigures
Figure 1 \u2013 S-FBGA and S-FLGA outline <\/td>\n<\/tr>\n
13<\/td>\n7 Dimensions and tolerances
Figure 2 \u2013 Mechanical gauge drawing
Figure 3 \u2013 Array of terminal-existence areas <\/td>\n<\/tr>\n
14<\/td>\nTables
Table 1 \u2013 Dimensions and tolerances <\/td>\n<\/tr>\n
16<\/td>\nTable 2 \u2013 Combination list of D, E, MD, and ME for e = 0,30 mm pitch S-FBGA (informative) <\/td>\n<\/tr>\n
17<\/td>\nTable 3 \u2013 Combination list of D, E, MD, and ME for e = 0,25 mm pitch S-FLGA <\/td>\n<\/tr>\n
18<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Fibre optic active components and devices. Package and interface standards – Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2019<\/td>\n20<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":248381,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[650,2641],"product_tag":[],"class_list":{"0":"post-248376","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-33-180-20","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/248376","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/248381"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=248376"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=248376"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=248376"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}