{"id":335647,"date":"2024-10-19T23:26:30","date_gmt":"2024-10-19T23:26:30","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-16602-70-122016\/"},"modified":"2024-10-25T22:23:44","modified_gmt":"2024-10-25T22:23:44","slug":"bs-en-16602-70-122016","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-16602-70-122016\/","title":{"rendered":"BS EN 16602-70-12:2016"},"content":{"rendered":"

This European Standard specifies the requirements for the supplier and PCB manufacturer for PCB design.<\/p>\n

This European Standard is applicable for all types of PCBs, including sequential, rigid and flexible PCBs, HDI and RF PCBs.<\/p>\n

This European Standard can be made applicable for other products combining mechanical and electrical functionality using additive or reductive manufacturing processes, as used in PCB manufacturing. Examples of such products are slip rings and bus bars.<\/p>\n

This European Standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
16<\/td>\n1 Scope <\/td>\n<\/tr>\n
17<\/td>\n2 Normative references <\/td>\n<\/tr>\n
18<\/td>\n3 Terms, definitions and abbreviated terms
3.1 Terms from other standards
3.2 Terms specific to the present standard <\/td>\n<\/tr>\n
26<\/td>\n3.3 Abbreviated terms <\/td>\n<\/tr>\n
28<\/td>\n4 Principles
4.1 Qualified PCBs
4.2 Manufacturing tolerances
4.3 Reliability of design <\/td>\n<\/tr>\n
30<\/td>\n5 Design review and MRR
5.1 Overview
5.2 Documentation <\/td>\n<\/tr>\n
32<\/td>\n6 General design and production requirements
6.1 Reliability of design
6.2 Choice of materials and build-up
6.2.1 Overview <\/td>\n<\/tr>\n
35<\/td>\n6.2.2 Material selection
6.3 Selection of the PCB manufacturer
6.4 Traceability and marking <\/td>\n<\/tr>\n
36<\/td>\n7 Rigid PCBs
7.1 PCB build-up
7.1.1 General
7.1.2 Copper styles <\/td>\n<\/tr>\n
38<\/td>\n7.1.3 Dielectric thickness <\/td>\n<\/tr>\n
41<\/td>\n7.2 PCB dimension
7.3 Thickness of PCB
7.3.1 General <\/td>\n<\/tr>\n
42<\/td>\n7.3.2 Polyimide PCB
7.3.3 Epoxy PCB
7.3.4 Number of copper layers in PCB
7.3.5 Aspect ratio of vias <\/td>\n<\/tr>\n
43<\/td>\n7.4 Track width and spacing
7.4.1 General
7.4.2 Manufacturing tolerances for width and spacing <\/td>\n<\/tr>\n
44<\/td>\n7.4.3 External layers <\/td>\n<\/tr>\n
45<\/td>\n7.4.4 Normal pitch tracks on internal layers <\/td>\n<\/tr>\n
46<\/td>\n7.4.5 Fine pitch tracks on internal layers <\/td>\n<\/tr>\n
47<\/td>\n7.4.6 Routing to AAD footprint on internal layers <\/td>\n<\/tr>\n
48<\/td>\n7.5 Pad design
7.5.1 Non-functional pad removal
7.5.2 Pad dimensions <\/td>\n<\/tr>\n
50<\/td>\n7.5.3 Non-circular external pads <\/td>\n<\/tr>\n
51<\/td>\n7.6 Copper planes in rigid PCB <\/td>\n<\/tr>\n
52<\/td>\n7.7 Design considerations for the prevention of sliver and peelable
7.8 PCB surface finish
7.8.1 Metallization <\/td>\n<\/tr>\n
53<\/td>\n7.8.2 Solder mask
7.8.2.1 Overview
7.8.2.2 Use of solder mask <\/td>\n<\/tr>\n
54<\/td>\n8 Flex PCBs
8.1 Overview
8.2 Dynamic applications
8.3 PCB build-up
8.3.1 General
8.3.2 Dielectric materials <\/td>\n<\/tr>\n
55<\/td>\n8.3.3 Copper cladding
8.3.4 Copper planes in flex PCB <\/td>\n<\/tr>\n
56<\/td>\n8.4 Track design <\/td>\n<\/tr>\n
57<\/td>\n8.5 Through holes
8.5.1 Annular ring <\/td>\n<\/tr>\n
58<\/td>\n8.5.2 Vias and pads
8.5.3 Tear drop pad for flex PCB <\/td>\n<\/tr>\n
59<\/td>\n8.6 Bending radius
8.6.1 Overview
8.6.2 General <\/td>\n<\/tr>\n
60<\/td>\n8.7 Sculptured flex PCB
8.7.1 Overview
8.7.2 General
8.7.3 Copper foil dimensions for build-up <\/td>\n<\/tr>\n
61<\/td>\n8.7.4 Connection finger <\/td>\n<\/tr>\n
62<\/td>\n8.7.5 Through-holes <\/td>\n<\/tr>\n
63<\/td>\n8.7.6 Bending radius <\/td>\n<\/tr>\n
64<\/td>\n9 Rigid-flex PCBs
9.1 Overview
9.2 General <\/td>\n<\/tr>\n
65<\/td>\n9.3 Build-up <\/td>\n<\/tr>\n
66<\/td>\n9.4 Cover layer
9.5 Interface of rigid part and flexible part
9.6 Pads <\/td>\n<\/tr>\n
67<\/td>\n10 Thermal rules and heat sinks
10.1 Overview
10.2 General requirements
10.3 Specific requirements for external heat sink
10.3.1 Overview
10.3.2 Construction of the interface between PCB and heat sink <\/td>\n<\/tr>\n
68<\/td>\n10.3.3 Dimensional requirements <\/td>\n<\/tr>\n
70<\/td>\n10.4 Specific requirements for internal heat sink
10.4.1 General
10.4.2 Cu thickness and type <\/td>\n<\/tr>\n
71<\/td>\n10.4.3 CIC and Molybdenum inserts
10.4.4 Dimensional requirements <\/td>\n<\/tr>\n
73<\/td>\n11 HDI PCBs
11.1 Overview
11.2 Justification
11.3 Microvia technology <\/td>\n<\/tr>\n
74<\/td>\n11.4 Microvias
11.4.1 Build-up of microvia layers <\/td>\n<\/tr>\n
76<\/td>\n11.4.2 Design of microvias
11.4.3 Pad design for microvia <\/td>\n<\/tr>\n
77<\/td>\n11.4.4 Annular ring for microvias
11.5 Core PCB for HDI
11.5.1 General build-up <\/td>\n<\/tr>\n
78<\/td>\n11.5.2 Annular ring on vias for fine pitch footprint <\/td>\n<\/tr>\n
79<\/td>\n11.5.3 Track width and spacing on external layers
11.5.4 Track width and spacing on internal layers for impedance control and routing to AAD <\/td>\n<\/tr>\n
80<\/td>\n11.5.5 Track width and spacing on internal layers for differential pair routing within the footprint of 1,0 mm pitch AAD <\/td>\n<\/tr>\n
81<\/td>\n11.5.6 Aspect ratio of vias for footprint of AAD with 1 mm pitch <\/td>\n<\/tr>\n
83<\/td>\n12 PCBs for high frequency applications
12.1 Material selection
12.2 Build-up of RF PCB
12.3 Embedded film resistors <\/td>\n<\/tr>\n
85<\/td>\n12.4 Thickness of RF PCB
12.5 Track width and spacing
12.5.1 External layers <\/td>\n<\/tr>\n
86<\/td>\n12.5.2 Internal Layers
12.6 Pad design
12.6.1 Pad dimensions
12.6.2 Non-functional pads
12.7 Surface finish
12.8 Profiled layers and vias <\/td>\n<\/tr>\n
88<\/td>\n13 Electrical requirements for PCB design
13.1 Overview <\/td>\n<\/tr>\n
89<\/td>\n13.2 General
13.3 PCB drying
13.4 Electrical characteristics <\/td>\n<\/tr>\n
90<\/td>\n13.5 Floating metal
13.6 Current rating
13.6.1 Overview <\/td>\n<\/tr>\n
91<\/td>\n13.6.2 Requirements for temperature increment
13.6.3 Requirements for the model IPC-2152 for current rating <\/td>\n<\/tr>\n
92<\/td>\n13.6.4 Amendments to the model from IPC-2152
13.6.4.1 Overview <\/td>\n<\/tr>\n
93<\/td>\n13.6.4.2 List of amendments
13.7 Provisions to prevent open circuit failure on critical tracks
13.7.1 Overview <\/td>\n<\/tr>\n
94<\/td>\n13.7.2 Routing
13.8 Voltage rating
13.8.1 Overview
13.8.2 General requirements <\/td>\n<\/tr>\n
96<\/td>\n13.8.3 Spacing on flex and rigid-flex laminate <\/td>\n<\/tr>\n
97<\/td>\n13.8.4 Conformal coating <\/td>\n<\/tr>\n
98<\/td>\n13.9 Double insulation design rules for critical tracks
13.9.1 Overview
13.9.2 Critical nets
13.9.3 Prevention of short circuit
13.9.3.1 Increase insulation in the PCB <\/td>\n<\/tr>\n
100<\/td>\n13.9.3.2 Increase insulation of PCB assembly <\/td>\n<\/tr>\n
101<\/td>\n13.9.3.3 Routing <\/td>\n<\/tr>\n
103<\/td>\n13.10 Insulation distance of combined requirements on rigid PCB <\/td>\n<\/tr>\n
108<\/td>\n13.11 Controlled impedance tracks
13.11.1 Definitions specific to controlled impedance
13.11.2 General rules
13.11.3 Microstrip and stripline <\/td>\n<\/tr>\n
109<\/td>\n13.11.4 Line impedance termination for end-to-end configuration
13.11.5 Line impedance termination for multidrop configuration <\/td>\n<\/tr>\n
110<\/td>\n13.12 Digital PCB
13.12.1 Overview
13.12.2 Zone management and routing <\/td>\n<\/tr>\n
111<\/td>\n13.12.3 Criticality of digital signals
13.12.3.1 Non-critical signals
13.12.3.2 Critical signals <\/td>\n<\/tr>\n
112<\/td>\n13.12.3.3 Highly critical signals
13.13 Analog PCB
13.13.1 Overview
13.13.2 Criticality of analog signals
13.13.2.1 Non-critical signals <\/td>\n<\/tr>\n
113<\/td>\n13.13.2.2 Critical signals
13.13.2.3 Highly critical signals
13.13.3 Routing and shielding <\/td>\n<\/tr>\n
114<\/td>\n13.14 Mixed analog-digital PCB <\/td>\n<\/tr>\n
115<\/td>\n14 Design for assembly
14.1 Overview
14.2 General <\/td>\n<\/tr>\n
116<\/td>\n14.3 Placement requirements
14.3.1 Conductive patterns <\/td>\n<\/tr>\n
117<\/td>\n14.3.2 Components <\/td>\n<\/tr>\n
119<\/td>\n14.3.3 Component pads <\/td>\n<\/tr>\n
120<\/td>\n14.3.4 Fan out of SMT pads <\/td>\n<\/tr>\n
122<\/td>\n14.3.5 Fan out of PTH <\/td>\n<\/tr>\n
123<\/td>\n14.4 Specific requirements for fused tin-lead finish
14.5 Dimensional requirements for SMT foot print
14.5.1 Overview <\/td>\n<\/tr>\n
124<\/td>\n14.5.2 General <\/td>\n<\/tr>\n
125<\/td>\n14.5.3 Bipolar components <\/td>\n<\/tr>\n
126<\/td>\n14.5.4 SOIC components <\/td>\n<\/tr>\n
127<\/td>\n14.5.5 J-leaded components <\/td>\n<\/tr>\n
128<\/td>\n14.5.6 LCC components <\/td>\n<\/tr>\n
130<\/td>\n14.5.7 Flat pack components <\/td>\n<\/tr>\n
131<\/td>\n14.5.8 AAD components <\/td>\n<\/tr>\n
132<\/td>\n15 Design of test coupon
15.1 Design rules for test coupon
15.2 Test coupon design <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Space product assurance. Design rules for printed circuit boards<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2016<\/td>\n176<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":335653,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-335647","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/335647","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/335653"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=335647"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=335647"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=335647"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}