This part of IEC 62025 specifies a test method for the non-electrical characteristics of the surface mounted device (SMD) inductors to be used for electronic and telecommunication equipment. The object of this part of this document is to define methods for measuring mechanical performance only. As the reliability performances and specifications relative to non-electrical performances are defined in IEC 62211, detailed measuring methods for mechanical performance of reliability testing are defined in this document.<\/p>\n
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| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 3 Terms and definitions 4 Test conditions 4.1 Standard atmospheric conditions for test 4.2 Referee conditions 5 Mechanical characteristics test 5.1 Body strength test 5.1.1 Body strength test procedures <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | Figures Figure 1 \u2013 Method for pressurizing the body <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 5.1.2 Information to be given in the detail specification 5.2 Robustness of terminations (electrodes) 5.2.1 Resistance to bending of printed-circuit board Figure 2 \u2013 Pressurizing jig <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | Figure 3 \u2013 Example of printed-circuit board Tables Table 1 \u2013 Size of soldering lands according to the code of multi-layer chip inductors <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | Table 2 \u2013 Thickness of solder paste by the size code of inductors <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | Figure 4 \u2013 Layout Figure 5 \u2013 Pressurizing jig Figure 6 \u2013 Pressurizing <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 5.2.2 Adherence test (see test of Ue3 of IEC 60068-2-21) <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | Figure 7 \u2013 Pressurizing and shape of jig <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 5.3 Solderability 5.3.1 General 5.3.2 Preconditioning 5.3.3 Initial measurement 5.3.4 Test method <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | Table 3 \u2013 Conditions of immersion into solder Table 4 \u2013 Reflow temperature <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 5.3.5 Recovery 5.3.6 Final measurement 5.3.7 Items to be specified in detail specification Figure 8 \u2013 Reflow temperature profile <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 5.4 Resistance to soldering heat 5.4.1 General 5.4.2 Preconditioning 5.4.3 Initial measurement 5.4.4 Test method Table 5 \u2013 Severity <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | 5.4.5 Recovery 5.4.6 Final measurement 5.4.7 Items to be specified in detail specification Table 6 \u2013 Reflow temperature <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 5.5 Resistance to dissolution of metallization 5.5.1 General 5.5.2 Preconditioning 5.5.3 Initial measurement 5.5.4 Test methods 5.5.5 Final measurements <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 5.5.6 Items to be specified in detail specification 5.6 Vibration 5.6.1 Test equipment 5.6.2 Preparation 5.6.3 Test method 5.6.4 Items to be specified in detail specification Table 7 \u2013 Conditions of vibration <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 5.7 Resistance to shock 5.7.1 Mechanical shock method 5.7.2 Items to be specified in detail specification <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | Annex A (normative) Mounting of surface mounting inductor on test printed-circuit board A.1 General A.2 Mounting printed-circuit board and mounting land A.3 Solder <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | A.4 Preparation A.5 Preheating A.6 Soldering A.7 Cleaning <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" High frequency inductive components. Non-electrical characteristics and measuring methods – Test methods for non-electrical characteristics<\/b><\/p>\n |