{"id":422825,"date":"2024-10-20T06:43:06","date_gmt":"2024-10-20T06:43:06","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-61191-22017-3\/"},"modified":"2024-10-26T12:35:54","modified_gmt":"2024-10-26T12:35:54","slug":"bs-en-61191-22017-3","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-61191-22017-3\/","title":{"rendered":"BS EN 61191-2:2017"},"content":{"rendered":"

This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through- hole, chip mounting, terminal mounting, etc.).<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
7<\/td>\nCONTENTS <\/td>\n<\/tr>\n
10<\/td>\nFOREWORD <\/td>\n<\/tr>\n
12<\/td>\n1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Surface mounting of components
5.1 General <\/td>\n<\/tr>\n
13<\/td>\n5.2 Alignment requirements
5.3 Process control
5.4 Surface mounted component requirements
5.5 Flatpack lead forming
5.5.1 General
5.5.2 Surface mounted device lead bends
Figures
Figure 1 \u2013 Lead formation for surface mounted device <\/td>\n<\/tr>\n
14<\/td>\n5.5.3 Surface mounted device lead deformation
5.5.4 Flattened leads
5.5.5 Dual-in-line packages (DIPs)
5.5.6 Parts not configured for surface mounting
5.6 Small devices with two terminations
5.6.1 General
5.6.2 Stack mounting
5.6.3 Devices with external deposited elements <\/td>\n<\/tr>\n
15<\/td>\n5.7 Lead component body positioning
5.7.1 General
5.7.2 Axial-leaded components
5.7.3 Other components
5.8 Parts configured for butt lead mounting
5.9 Non-conductive adhesive coverage limits
6 Acceptance requirements
6.1 General
6.2 Control and corrective actions <\/td>\n<\/tr>\n
16<\/td>\n6.3 Surface soldering of leads and terminations
6.3.1 General
6.3.2 Solder fillet height and heel fillets <\/td>\n<\/tr>\n
17<\/td>\n6.3.3 Flat ribbon L and gull-wing leads
Figure 2 \u2013 Fillet height <\/td>\n<\/tr>\n
18<\/td>\n6.3.4 Round or flattened (coined) leads
Figure 3 \u2013 Flat ribbon and gull-wing leads <\/td>\n<\/tr>\n
19<\/td>\n6.3.5 J leads
Figure 4 \u2013 Round or flattened (coined) lead joint <\/td>\n<\/tr>\n
20<\/td>\n6.3.6 Rectangular or square end component
Figure 5 \u2013 J lead joint <\/td>\n<\/tr>\n
21<\/td>\n6.3.7 Cylindrical end-cap terminations
Figure 6 \u2013 Rectangular or square end components <\/td>\n<\/tr>\n
22<\/td>\n6.3.8 Bottom only terminations
Figure 7 \u2013 Cylindrical end-cap terminations <\/td>\n<\/tr>\n
23<\/td>\n6.3.9 Castellated terminations
Figure 8 \u2013 Bottom only terminations <\/td>\n<\/tr>\n
24<\/td>\n6.3.10 Butt joints
Figure 9 \u2013 Leadless chip carriers with castellated terminations <\/td>\n<\/tr>\n
25<\/td>\n6.3.11 Inward L-shaped ribbon leads
Figure 10 \u2013 Butt joints <\/td>\n<\/tr>\n
26<\/td>\n6.3.12 Flat lug leads
Figure 11 \u2013 Inward L-shaped ribbon leads <\/td>\n<\/tr>\n
27<\/td>\n6.3.13 Ball grid array
Figure 12 \u2013 Flat lug leads <\/td>\n<\/tr>\n
28<\/td>\n6.3.14 Column grid array
Figure 13 \u2013 BGA with collapsing balls
Tables
Table 1 \u2013 BGA with non-collapsing balls
Table 2 \u2013 Column grid array <\/td>\n<\/tr>\n
29<\/td>\n6.3.15 Bottom termination components
6.3.16 Components with bottom thermal plane terminations (D-Pak)
Figure 14 \u2013 Bottom termination components <\/td>\n<\/tr>\n
30<\/td>\nFigure 15 \u2013 Bottom thermal plane terminations <\/td>\n<\/tr>\n
31<\/td>\n6.3.17 P-style terminations
6.4 General post-soldering requirements applicable to all surface-mounted assemblies
6.4.1 Dewetting
6.4.2 Leaching
6.4.3 Pits, voids, blowholes, and cavities
Figure 16 \u2013 P-style terminations <\/td>\n<\/tr>\n
32<\/td>\n6.4.4 Solder wicking
6.4.5 Solder webs and skins
6.4.6 Bridging
6.4.7 Degradation of marking
6.4.8 Solder spikes
6.4.9 Disturbed joint
6.4.10 Component damage
6.4.11 Open circuit, non-wetting
6.4.12 Component tilting <\/td>\n<\/tr>\n
33<\/td>\n6.4.13 Non-conducting adhesive encroachment
6.4.14 Open circuit, no solder available
6.4.15 Component on edge
7 Rework and repair <\/td>\n<\/tr>\n
34<\/td>\nTable 3 \u2013 Reworkable defects <\/td>\n<\/tr>\n
35<\/td>\nAnnex A (normative)Placement requirements for surface mounted devices
A.1 General
A.2 Component positioning
A.3 Small devices incorporating two terminations
A.3.1 Metallization coverage over the land (side-to-side)
A.3.2 Metallization coverage over the land (end)
A.4 Mounting of cylindrical end-cap devices (MELFs)
A.5 Registration of castellated chip carriers
A.6 Surface mounted device lead and land contact
A.7 Surface mounted device lead side overhang <\/td>\n<\/tr>\n
36<\/td>\nA.8 Surface mounted device lead toe overhang
A.9 Surface mounted device lead height off land (prior to soldering)
A.10 Positioning of J lead devices
A.11 Positioning gull-wing lead devices
A.12 External connections to packaging and interconnect structures <\/td>\n<\/tr>\n
37<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2019<\/td>\n40<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":422835,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-422825","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/422825","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/422835"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=422825"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=422825"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=422825"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}