{"id":445780,"date":"2024-10-20T08:43:29","date_gmt":"2024-10-20T08:43:29","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-23-30436874-dc-2023\/"},"modified":"2024-10-26T16:15:02","modified_gmt":"2024-10-26T16:15:02","slug":"bsi-23-30436874-dc-2023","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-23-30436874-dc-2023\/","title":{"rendered":"BSI 23\/30436874 DC 2023"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 1 Scope 2 Normative references 3 Terms definitions and abbreviated terms 3.1 Terms and definitions 3.2 Abbreviated terms Terms and definitions 4 General <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 5 Test specimen 5.1 General 5.2 Preparation of test specimen <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 6 Test apparatus <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 7 Test method and test procedure 7.1 General <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" BS EN IEC 62878-2-603. Device embedding assembly technology – Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity<\/b><\/p>\n |