{"id":458356,"date":"2024-10-20T09:56:19","date_gmt":"2024-10-20T09:56:19","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-24-30492188-dc\/"},"modified":"2024-10-26T18:29:07","modified_gmt":"2024-10-26T18:29:07","slug":"bsi-24-30492188-dc","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-24-30492188-dc\/","title":{"rendered":"BSI 24\/30492188 DC"},"content":{"rendered":"

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
6<\/td>\nFOREWORD <\/td>\n<\/tr>\n
8<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
9<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
11<\/td>\n4 Definition of DXRC
4.1 General
4.2 Thermal Resistance and Capacitance (RC) topology of DXRC
4.2.1 Thermal RC topology of DXRC
4.2.2 Outline of DXRC <\/td>\n<\/tr>\n
12<\/td>\n4.2.3 RC values on NJA-RC
4.2.4 RC values on MPA-RC <\/td>\n<\/tr>\n
14<\/td>\nAnnex A (informative) Accuracy Verification of DXRC model for TO-252
A.1 General
A.2 CFD Model <\/td>\n<\/tr>\n
16<\/td>\nA.3 Calculation of thermal RC values <\/td>\n<\/tr>\n
17<\/td>\nA.4 MPA-RC and DXRC model outline
A.5 Optimization of RC values in MPA-RC <\/td>\n<\/tr>\n
18<\/td>\nA.6 Result <\/td>\n<\/tr>\n
20<\/td>\nAnnex B (informative) Accuracy Verification of DXRC model for TO-263
B.1 General
B.2 CFD Model <\/td>\n<\/tr>\n
22<\/td>\nB.3 Calculation of thermal RC values <\/td>\n<\/tr>\n
23<\/td>\nB.4 MPA-RC and DXRC model outline
B.5 Optimization of RC values in MPA-RC <\/td>\n<\/tr>\n
24<\/td>\nB.6 Result <\/td>\n<\/tr>\n
25<\/td>\nAnnex C (informative) Accuracy Verification of DXRC model for HSOP
C.1 General
C.2 CFD Model <\/td>\n<\/tr>\n
26<\/td>\nC.3 Calculation of thermal RC values <\/td>\n<\/tr>\n
28<\/td>\nC.4 MPA-RC and DXRC model outline
C.5 Optimization of RC values in MPA-RC <\/td>\n<\/tr>\n
29<\/td>\nC.6 Result <\/td>\n<\/tr>\n
30<\/td>\nAnnex D (informative) The effect of PCB layers
D.1 General
D.2 Verification Method
D.3 Result <\/td>\n<\/tr>\n
32<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Draft BS EN 63378-6 ED1. Thermal standardization on semiconductor packages – Part 6. Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2024<\/td>\n32<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":458367,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[573,2641],"product_tag":[],"class_list":{"0":"post-458356","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-01","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/458356","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/458367"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=458356"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=458356"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=458356"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}