{"id":79406,"date":"2024-10-17T18:34:07","date_gmt":"2024-10-17T18:34:07","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/ieee-896-5-1994\/"},"modified":"2024-10-24T19:40:02","modified_gmt":"2024-10-24T19:40:02","slug":"ieee-896-5-1994","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/ieee\/ieee-896-5-1994\/","title":{"rendered":"IEEE 896.5 1994"},"content":{"rendered":"

New IEEE Standard – Inactive – Withdrawn. Withdrawn Standard. Withdrawn Date: Jan 10, 2002. No longer endorsed by the IEEE. Futurebus+ standards provide systems developers with a set of tools with which high performance bus-based systems may be developed. This architecture provides a wide range of performance scalability over both cost and time for multiple generations of single- and multiple-bus multiprocessor systems. This document, a companion standard to IEEE Std 896.1-1991, builds on the logical layer by adding requirements for three military profiles. It is to these profiles that products will claim conformance.Other specifications that may be required in conjunction with this standard are IEEE Std 896.1-1991, IEEE Std 896.2- 1991, IEEE Std 896.3-1993, IEEE Std 896.4-1993, IEEE Std 1101.3-1993, IEEE Std 1101.4-1993, IEEE Std 1212-1991, IEEE Std 1194-1, 1991, IEEE P1394, IEEE Std 1301-1991, and IEEE Std 1301.1-1991.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
3<\/td>\nLogical layer detailed specification <\/td>\n<\/tr>\n
9<\/td>\nOverview
1.1 Scope
47 (m) (A) (B) (B)
48 (m) (BUS-) (m) (D) <\/td>\n<\/tr>\n
10<\/td>\n1.2 Applicability
References
15 ) <\/td>\n<\/tr>\n
11<\/td>\nDefinitions
Special word usage
3.2 General definitions
45 (ISOGND) (7) (sHLD) (-)
(NED’) <\/td>\n<\/tr>\n
12<\/td>\n4 (mtm) <\/td>\n<\/tr>\n
13<\/td>\n(GA2′) <\/td>\n<\/tr>\n
15<\/td>\nMilitary Profile MIL-12SU
4.1 Reference specification
7 (2-AD22′) <\/td>\n<\/tr>\n
17<\/td>\n(T)
(AK’) <\/td>\n<\/tr>\n
18<\/td>\n(T) <\/td>\n<\/tr>\n
19<\/td>\n11 <\/td>\n<\/tr>\n
20<\/td>\n12
22
12
12 (m) <\/td>\n<\/tr>\n
21<\/td>\nLogical layer detailed specifications
(ET*)
13
13
13 <\/td>\n<\/tr>\n
22<\/td>\n14
14
14 <\/td>\n<\/tr>\n
23<\/td>\n15
15 (2-AD4′-) <\/td>\n<\/tr>\n
24<\/td>\n16
16 <\/td>\n<\/tr>\n
25<\/td>\n17
17 <\/td>\n<\/tr>\n
26<\/td>\n18
18 <\/td>\n<\/tr>\n
27<\/td>\nBus and node management
19
19
19 (W) <\/td>\n<\/tr>\n
28<\/td>\n20
20 <\/td>\n<\/tr>\n
29<\/td>\n21
21 <\/td>\n<\/tr>\n
30<\/td>\n22 <\/td>\n<\/tr>\n
31<\/td>\nST4′
232323- <\/td>\n<\/tr>\n
32<\/td>\n(ST3*)
24
24 <\/td>\n<\/tr>\n
33<\/td>\n25
25
25 <\/td>\n<\/tr>\n
34<\/td>\n26
AD9′ <\/td>\n<\/tr>\n
35<\/td>\n27 <\/td>\n<\/tr>\n
36<\/td>\n28
28 <\/td>\n<\/tr>\n
37<\/td>\n4.4 Physical layer detailed specification
29
29 <\/td>\n<\/tr>\n
38<\/td>\n(AD19′)
30 <\/td>\n<\/tr>\n
39<\/td>\n31
38
31 <\/td>\n<\/tr>\n
40<\/td>\n32
32 <\/td>\n<\/tr>\n
41<\/td>\n33
33 <\/td>\n<\/tr>\n
42<\/td>\n34 <\/td>\n<\/tr>\n
43<\/td>\n35 <\/td>\n<\/tr>\n
44<\/td>\nRC <\/td>\n<\/tr>\n
45<\/td>\nST
37
37 <\/td>\n<\/tr>\n
46<\/td>\nRS
38 <\/td>\n<\/tr>\n
47<\/td>\n39
39
39 <\/td>\n<\/tr>\n
48<\/td>\nDM
40
Gm <\/td>\n<\/tr>\n
49<\/td>\nRR
I1
41 (Kd <\/td>\n<\/tr>\n
50<\/td>\n42 (GR-27*) <\/td>\n<\/tr>\n
51<\/td>\nCTT )
43
43 (Em59 <\/td>\n<\/tr>\n
52<\/td>\nSG
2-AD20′ <\/td>\n<\/tr>\n
53<\/td>\n45 <\/td>\n<\/tr>\n
54<\/td>\n46 cm) (m) (m) (m)
16
46
46 <\/td>\n<\/tr>\n
55<\/td>\n47 (suscT) (Tmnr) (suscT) (TtmT)
47
2-AD27′
47 (RQ1-223
47 <\/td>\n<\/tr>\n
56<\/td>\n48 (r) (m) (T) (m)
48 <\/td>\n<\/tr>\n
57<\/td>\n49 (RQ1-209
49 <\/td>\n<\/tr>\n
58<\/td>\n50 c3ia <\/td>\n<\/tr>\n
62<\/td>\n54 (GR-16′) <\/td>\n<\/tr>\n
63<\/td>\naim <\/td>\n<\/tr>\n
64<\/td>\nmiail <\/td>\n<\/tr>\n
66<\/td>\n58 (m)
miail <\/td>\n<\/tr>\n
67<\/td>\naim <\/td>\n<\/tr>\n
69<\/td>\n61 <\/td>\n<\/tr>\n
71<\/td>\n63 (=*I
cma <\/td>\n<\/tr>\n
73<\/td>\n65 (RQ1-5*)
65 <\/td>\n<\/tr>\n
74<\/td>\n66 (-) <\/td>\n<\/tr>\n
75<\/td>\n4.5 Environmental
cma <\/td>\n<\/tr>\n
76<\/td>\n4.6 Systems configuration guide
4.7 Conformance testing <\/td>\n<\/tr>\n
77<\/td>\nMilitary Profile MIL- lOSU
5.1 Reference specification
69 (m) <\/td>\n<\/tr>\n
78<\/td>\nGim <\/td>\n<\/tr>\n
83<\/td>\nLogical layer detailed specification t: <\/td>\n<\/tr>\n
85<\/td>\nBus and node management
Physical layer detailed specification <\/td>\n<\/tr>\n
110<\/td>\n5.5 Environmental <\/td>\n<\/tr>\n
112<\/td>\nSystems configuration guide
5.7 Conformance testing <\/td>\n<\/tr>\n
113<\/td>\nMilitary Profile MIL-Format E
6.1 Reference specification <\/td>\n<\/tr>\n
120<\/td>\nBus and node management
Physical layer detailed specification <\/td>\n<\/tr>\n
142<\/td>\n6.5 Environmental <\/td>\n<\/tr>\n
143<\/td>\nSystem configuration guide
6.7 Conformance testing <\/td>\n<\/tr>\n
145<\/td>\nMilitary-specific standard units
Software development unit <\/td>\n<\/tr>\n
154<\/td>\nA.2 History units <\/td>\n<\/tr>\n
157<\/td>\nAlternate access unit <\/td>\n<\/tr>\n
171<\/td>\nA.4 Input\/Output units
Power fail imminent (PFI) CSRs <\/td>\n<\/tr>\n
175<\/td>\nModular open architecture overview
B.l Introduction <\/td>\n<\/tr>\n
176<\/td>\nOverview of backplane interconnects <\/td>\n<\/tr>\n
185<\/td>\nB.3 Backplane construction
Pin assignments for special classes of modules
B.5 AnalogRF modules <\/td>\n<\/tr>\n
186<\/td>\nB 10 Nonintrusive software development\/debug support <\/td>\n<\/tr>\n
187<\/td>\nB 11 Shared-memory and message-passing paradigms
B.12 Conformance test requirements <\/td>\n<\/tr>\n
188<\/td>\nAnnex C Current per connector pin guidelines
C.l Current per connector pin issue <\/td>\n<\/tr>\n
192<\/td>\nFault tolerant extension CSRs
D.l Description <\/td>\n<\/tr>\n
201<\/td>\nAnnex E
Example ROM entries for a MIL profile module
E.1 Introduction <\/td>\n<\/tr>\n
208<\/td>\nAnnex F Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

IEEE Standard for Futurebus+(R), Profile M (Military)<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
IEEE<\/b><\/a><\/td>\n1994<\/td>\n208<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":79407,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2644],"product_tag":[],"class_list":{"0":"post-79406","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-ieee","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/79406","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/79407"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=79406"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=79406"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=79406"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}