IEC 60384-19:2015 is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto substrates for hybrid circuits or onto printed boards. These capacitors may have “self-healing properties” depending on conditions of use. They are primarily intended for applications where the a.c. component is small with respect to the rated voltage. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384 14. This edition includes the following significant technical changes with respect to the previous edition: a) Revised all parts of the document based on the IEC Directives Part 2:2011 (sixth edition) to the extent practicable, and harmonization between other similar kind of documents. b) Revised tables and Clause 4 so as to prevent duplications and contradictions.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 1 General 1.1 Scope 1.2 Object 1.3 Normative references <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 1.4 Information to be given in a detail specification 1.4.1 General 1.4.2 Outline drawing and dimensions 1.4.3 Mounting 1.4.4 Ratings and characteristics <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 1.4.5 Marking 1.5 Terms and definitions 1.6 Marking 1.6.1 General 1.6.2 Information for marking 1.6.3 Marking on capacitors <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 1.6.4 Marking on packaging 2 Preferred ratings and characteristics 2.1 Preferred characteristics 2.1.1 Preferred climatic categories 2.2 Preferred values of ratings 2.2.1 Nominal capacitance (CN) 2.2.2 Tolerance on nominal capacitance 2.2.3 Rated voltage (UR) <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 2.2.4 Category voltage (UC) 2.2.5 Rated temperature 3 Quality assessment procedures 3.1 Primary stage of manufacture 3.2 Structurally similar components 3.3 Certified test records of released lots 3.4 Qualification approval procedures 3.4.1 General 3.4.2 Qualification approval on the basis of the fixed sample size procedure Tables Table 1 \u2013 Percentage limit of the rated voltage at a.c. voltage frequency <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | Table 2 \u2013 Test and sampling plan for qualification approval Assessment level EZ <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | Table 3 \u2013 Test schedule for qualification approval (1 of 6) <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 3.5 Quality conformance inspection 3.5.1 Formation of inspection lots <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | 3.5.2 Test schedule 3.5.3 Delayed delivery 3.5.4 Assessment levels Table 4 \u2013 Lot-by-lot inspection <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 4 Test and measurement procedures 4.1 Mounting 4.2 Visual examination and check of dimensions 4.2.1 General 4.2.2 Visual examination and check of dimensions 4.2.3 Requirements 4.3 Electrical tests 4.3.1 Voltage proof Table 5 \u2013 Periodic inspection <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 4.3.2 Capacitance 4.3.3 Tangent of loss angle (tan () Table 6 \u2013 Test voltages <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 4.3.4 Insulation resistance Table 7 \u2013 Applicable tan \u03b4 values <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 4.4 Shear test Table 8 \u2013 Requirements regarding insulation resistance Table 9 \u2013 Correction factor dependent on temperature <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 4.5 Substrate bending test 4.5.1 General 4.5.2 Initial inspections 4.5.3 Final inspections and requirements 4.6 Resistance to soldering heat 4.6.1 General 4.6.2 Initial inspections 4.6.3 Test conditions 4.6.4 Recovery 4.6.5 Final inspections and requirements 4.7 Solderability 4.7.1 General <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 4.7.2 Test conditions 4.7.3 Final inspections and requirements 4.8 Rapid change of temperature 4.8.1 General 4.8.2 Initial inspections 4.8.3 Test conditions 4.8.4 Final inspections and requirements 4.9 Climatic sequence 4.9.1 General 4.9.2 Initial inspections 4.9.3 Dry heat <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | 4.9.4 Damp heat, cyclic, test Db, first cycle 4.9.5 Cold 4.9.6 Damp heat, cyclic, test Db, remaining cycles 4.9.7 Recovery 4.9.8 Final inspections and requirements 4.10 Damp heat, steady state 4.10.1 General 4.10.2 Initial inspections 4.10.3 Test conditions 4.10.4 Recovery 4.10.5 Final inspections and requirements <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | 4.11 Endurance 4.11.1 General 4.11.2 Initial inspections 4.11.3 Test conditions 4.11.4 Final inspections and requirements 4.12 Charge and discharge 4.12.1 General 4.12.2 Initial inspections 4.12.3 Test conditions Table 10 \u2013 Test conditions <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | 4.12.4 Recovery 4.12.5 Final inspections and requirements 4.13 Component solvent resistance (if applicable) 4.14 Solvent resistance of marking (if applicable) <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Fixed capacitors for use in electronic equipment – Sectional specification: Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c. capacitors<\/b><\/p>\n |