{"id":410127,"date":"2024-10-20T05:38:56","date_gmt":"2024-10-20T05:38:56","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-iec-63068-42022\/"},"modified":"2024-10-26T10:23:12","modified_gmt":"2024-10-26T10:23:12","slug":"bs-iec-63068-42022","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-iec-63068-42022\/","title":{"rendered":"BS IEC 63068-4:2022"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Principle <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 5 Requirements 5.1 General Table 1 \u2013 Combination table for identifying defects <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 5.2 Parameter settings 5.2.1 General <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 5.2.2 Parameter setting process 5.3 Procedure 5.4 Image evaluation 5.4.1 General 5.4.2 Mean width of planar and volume defects <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 5.4.3 Evaluation process 5.5 Precision 5.6 Test report 5.6.1 Mandatory elements <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 5.6.2 Optional elements <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Annex A (informative)Optical inspection and photoluminescence images of defects A.1 General A.2 Micropipe <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | A.3 TSD Figures Figure A.1 \u2013 Micropipe <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | A.4 TED Figure A.2 \u2013 TSD <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | A.5 BPD Figure A.3 \u2013 TED <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | A.6 Scratch trace Figure A.4 \u2013 BPD <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | A.7 Stacking fault Figure A.5 \u2013 Scratch trace <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | A.8 Propagated stacking fault Figure A.6 \u2013 Stacking fault <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | A.9 Stacking fault complex Figure A.7 \u2013 Propagated stacking fault <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | A.10 Polytype inclusion Figure A.8 \u2013 Stacking fault complex <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | A.11 Particle inclusion Figure A.9 \u2013 Polytype inclusion <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | A.12 Bunched-step segment Figure A.10 \u2013 Particle inclusion <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | Figure A.11 \u2013 Bunched-step segment <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | A.13 Surface particle Figure A.12 \u2013 Surface particle <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices – Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence<\/b><\/p>\n |