DIN 50002-1:2020 Edition

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Adhesive bondings in electronic applications – Bonding strength on surfaces – Part 1: Tensile test

Published By	Publication Date	Number of Pages
DIN	2020-03	17

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Categories: 31.020 - Electronic components in general, 83.180 - Adhesives, DIN

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Description

This standard specifies a test method for the assessment of the bondability of elements and for the determination of adhesive and compound characteristics using a cross tension test with tensile members such as headnails, pins and dollies.

Additional information

Published Code	DIN
Published By	Deutsches Institut für Normung
Publication Date	2020-03
Pages Count	17
Language	Germany
Descriptors	Adhesion, Adhesive strength, Adhesives, Bonding, Components, Compounds, Definitions, Electronic engineering, Electronic equipment and components, Fragmentation tests, Gellings, Materials testing, Sample preparation, Specimens, Surfaces, Tensile tests, Test performance, Testing, Testing devices, Checking equipment, Cures, Specimen preparation
File Size	2.6 MB
ICS Codes	31.020 - Electronic components in general 83.180 - Adhesives

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DIN 50002-1

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DIN 50002-1:2020 Edition

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