IEC 60384-21:2024 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric with a defined temperature coefficient (dielectric Class 1), intended for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included but are covered by IEC 60384-14. The object of this document is to specify preferred ratings and characteristics and to select from IEC 60384-1:2021 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements specified in detail specifications referring to this sectional specification provide specific test severities and requirements of an equal or higher performance level. Further information on the conception of generic, sectional and detail specifications can be found in the Introduction of IEC 60384-1:2021. This edition includes the following significant technical changes with respect to the previous edition: a) the document has been completely restructured to comply with the ISO\/IEC Directives, Part 2 and to make it more useable; tables, figures and references have been revised accordingly; Annex X contains all cross-references of changes in clause\/subclause numbers; b) the terms have been replaced by the letter symbols in Table 3; c) code of temperature coefficient and tolerance of C0G, U2J have been added in Table 4, Table 6, Table 8, Table 9, Table 11, Table 13, Table 16 and Annex B; d) the requirement in 5.5.2(visual examination) has been repeated in 5.9.3, 5.10.5, 5.11.4, 5.11.4, 5.13.7, 5.14.5 and 5.15.5; e) the deflection D in the very robust designs has been added in 5.9.1; f) Annex B has been changed informative into normative; g) Clause C.5 (Test schedule for quality conformance inspection) has been newly added to withdraw the blank detail specification: IEC 60384-21-1.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 4 Preferred ratings and characteristics 4.1 Preferred characteristics <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 4.2 Preferred values of ratings 4.2.1 Rated temperature (TR) 4.2.2 Rated voltage (UR) 4.2.3 Category voltage (UC) 4.2.4 Preferred values of nominal capacitance and associated tolerance values Tables Table 1 \u2013 Preferred tolerances on nominal capacitance <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 4.2.5 Temperature coefficient (\u03b1) Table 2 \u2013 Nominal temperature coefficient and tolerance (for reference temperature 20 \u00b0C) <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | Table 3 \u2013 Combination of temperature coefficient and tolerance <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 4.2.6 Dimensions 5 Test and measurement procedures 5.1 General 5.2 Preliminary drying 5.3 Measuring conditions 5.4 Mounting 5.5 Visual examination and check of dimensions 5.5.1 General 5.5.2 Visual examination 5.5.3 Requirements <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | Figures Figure 1 \u2013 Fault: crack or fissure Figure 2 \u2013 Fault: crack or fissure Figure 3 \u2013 Separation or delamination Figure 4 \u2013 Exposed electrodes <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 5.6 Electrical tests 5.6.1 Capacitance 5.6.2 Tangent of loss angle (tan \u03b4) Figure 5 \u2013 Principal faces <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 5.6.3 Insulation resistance Table 4 \u2013 Tangent of loss angle limits <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | 5.6.4 Voltage proof 5.7 Temperature coefficient (\u03b1) and temperature cyclic drift 5.7.1 General Table 5 \u2013 Test voltages <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 5.7.2 Preliminary drying 5.7.3 Measuring conditions 5.7.4 Requirements 5.8 Shear test 5.9 Substrate bending test 5.9.1 General 5.9.2 Initial measurement Table 6 \u2013 Temperature cyclic drift limits <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 5.9.3 Final inspection 5.10 Resistance to soldering heat 5.10.1 General 5.10.2 Initial measurement 5.10.3 Test conditions <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | 5.10.4 Recovery 5.10.5 Final inspection, measurements and requirements Figure 6 \u2013 Reflow temperature profile Table 7 \u2013 Reflow temperature profiles for Sn-Ag-Cu alloy Table 8 \u2013 Maximum capacitance change <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 5.11 Solderability 5.11.1 General 5.11.2 Test conditions 5.11.3 Recovery 5.11.4 Final inspection, measurements and requirements <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 5.12 Rapid change of temperature 5.12.1 General 5.12.2 Initial measurement 5.12.3 Number of cycles 5.12.4 Recovery 5.12.5 Final inspection, measurements and requirements 5.13 Climatic sequence 5.13.1 General 5.13.2 Initial measurement Table 9 \u2013 Maximum capacitance change <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 5.13.3 Dry heat 5.13.4 Damp heat, cyclic, Test Db, first cycle 5.13.5 Cold 5.13.6 Damp heat, cyclic, Test Db, remaining cycles 5.13.7 Final inspection, measurements and requirements Table 10 \u2013 Number of damp heat cycles Table 11 \u2013 Final inspection, measurements and requirements <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 5.14 Damp heat, steady state 5.14.1 General 5.14.2 Initial measurement 5.14.3 Test conditions 5.14.4 Recovery 5.14.5 Final inspection, measurements and requirements Table 12 \u2013 Test conditions for damp heat, steady state <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 5.15 Endurance 5.15.1 General 5.15.2 Initial measurement 5.15.3 Test conditions Table 13 \u2013 Final inspection, measurements and requirements Table 14 \u2013 Endurance test conditions (UC = UR) <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 5.15.4 Recovery 5.15.5 Final inspection, measurements and requirements 5.16 Robustness of terminations (only for capacitors with strip termination) 5.16.1 General 5.16.2 Test conditions Table 15 \u2013 Endurance test conditions (UC \u2260 UR) Table 16 \u2013 Final inspection, measurements and requirements <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | 5.16.3 Final inspection and requirements 5.17 Component solvent resistance (if required) 5.18 Solvent resistance of the marking (if required) 5.19 Accelerated damp heat, steady state (if required) 5.19.1 General 5.19.2 Initial measurement 5.19.3 Conditioning Table 17 \u2013 Initial requirements <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | 5.19.4 Recovery 5.19.5 Final measurements 6 Marking 6.1 General 6.2 Information for marking 6.3 Marking on the body 6.4 Requirements for marking Table 18 \u2013 Conditioning <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | 6.5 Marking of the packaging 6.6 Additional marking 7 Information to be given in a detail specification 7.1 General 7.2 Outline drawing and dimensions 7.3 Mounting 7.4 Rating and characteristics 7.4.1 General 7.4.2 Nominal capacitance range <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | 7.4.3 Particular characteristics 7.4.4 Soldering 7.5 Marking 8 Quality assessment procedures 8.1 Primary stage of manufacture 8.2 Structurally similar components 8.3 Certified records of released lots 8.4 Qualification approval 8.4.1 General 8.4.2 Qualification approval on the basis of the fixed sample size procedures <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | 8.4.3 Tests <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | Table 19 \u2013 Fixed sample size test plan for qualification approval Assessment level EZ <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | Table 20 \u2013 Tests schedule for qualification approval <\/td>\n<\/tr>\n | ||||||
| 40<\/td>\n | Annexes Annex A (normative) Guidance for the specification and coding of dimensions of fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 Figure A.1 \u2013 Dimensions Table A.1 \u2013 Dimensions <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | Annex B (normative) Combination of temperature coefficients and tolerances for the reference temperature of 25 \u00b0C Table B.1 \u2013 Combination of temperature coefficients and tolerances for the reference temperature of 25 \u00b0C <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | Annex C (normative) Quality conformance inspection C.1 Formation of inspection lots C.1.1 Groups A and B inspection C.1.2 Group C inspection C.2 Test schedule C.3 Delayed delivery C.4 Assessment levels <\/td>\n<\/tr>\n | ||||||
| 43<\/td>\n | C.5 Test schedule for quality conformance inspection Table C.1 \u2013 Lot by lot inspection Table C.2 \u2013 Periodic inspection <\/td>\n<\/tr>\n | ||||||
| 44<\/td>\n | Table C.3 \u2013 Test schedule for quality conformance inspection (lot by lot) <\/td>\n<\/tr>\n | ||||||
| 45<\/td>\n | Table C.4 \u2013 Test schedule for quality conformance inspection (Periodic test) <\/td>\n<\/tr>\n | ||||||
| 48<\/td>\n | Annex X (informative) Cross-reference for reference to IEC 60384-21:2019 Table X.1 \u2013 Reference to IEC 60384-21 for clause\/annex Table X.2 \u2013 Reference to IEC 60384-21 for figure\/table <\/td>\n<\/tr>\n | ||||||
| 49<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Fixed capacitors for use in electronic equipment – Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1<\/b><\/p>\n |