{"id":397798,"date":"2024-10-20T04:32:19","date_gmt":"2024-10-20T04:32:19","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/ieee-1838-2019\/"},"modified":"2024-10-26T08:20:26","modified_gmt":"2024-10-26T08:20:26","slug":"ieee-1838-2019","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/ieee\/ieee-1838-2019\/","title":{"rendered":"IEEE 1838-2019"},"content":{"rendered":"

New IEEE Standard – Active. IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding<\/p>\n

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PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
1<\/td>\nIEEE Std 1838\u2122-2019 Front cover <\/td>\n<\/tr>\n
2<\/td>\nTitle page <\/td>\n<\/tr>\n
4<\/td>\nImportant Notices and Disclaimers Concerning IEEE Standards Documents <\/td>\n<\/tr>\n
7<\/td>\nParticipants <\/td>\n<\/tr>\n
9<\/td>\nIntroduction <\/td>\n<\/tr>\n
10<\/td>\nContents <\/td>\n<\/tr>\n
11<\/td>\nList of Figures <\/td>\n<\/tr>\n
13<\/td>\nList of Tables <\/td>\n<\/tr>\n
14<\/td>\n1.\u2002Overview
1.1\u2002Scope <\/td>\n<\/tr>\n
15<\/td>\n1.2\u2002Three-dimensional integrated circuits (ICs) stacking technology <\/td>\n<\/tr>\n
16<\/td>\n1.3\u2002Motivation for a 3D-DfT standard
1.4\u2002Context
1.5\u2002Organization of the standard <\/td>\n<\/tr>\n
17<\/td>\n1.6\u2002Word usage
2.\u2002Normative references
3.\u2002Definitions, acronyms, and abbreviations
3.1\u2002Definitions <\/td>\n<\/tr>\n
22<\/td>\n3.2\u2002Acronyms and abbreviations <\/td>\n<\/tr>\n
24<\/td>\n4.\u2002Technology
4.1\u2002Stack model <\/td>\n<\/tr>\n
25<\/td>\n4.2\u2002Wafer-level die access <\/td>\n<\/tr>\n
26<\/td>\n4.3\u2002Physical attributes <\/td>\n<\/tr>\n
27<\/td>\n5.\u2002Serial test access ports
5.1\u2002Primary test access port <\/td>\n<\/tr>\n
29<\/td>\n5.2\u2002Primary test access port controller <\/td>\n<\/tr>\n
31<\/td>\n5.3\u2002Secondary test access port (STAP) <\/td>\n<\/tr>\n
32<\/td>\n5.4\u2002Secondary test access port control logic <\/td>\n<\/tr>\n
36<\/td>\n5.5\u2002Registers <\/td>\n<\/tr>\n
42<\/td>\n5.6\u2002Configuration elements <\/td>\n<\/tr>\n
43<\/td>\n6.\u2002Die wrapper register
6.1\u2002Register design <\/td>\n<\/tr>\n
48<\/td>\n6.2\u2002DWR cell structure and operation <\/td>\n<\/tr>\n
49<\/td>\n6.3\u2002DWR operation events <\/td>\n<\/tr>\n
50<\/td>\n6.4\u2002DWR operation modes <\/td>\n<\/tr>\n
52<\/td>\n6.5\u2002Parallel access to the DWR <\/td>\n<\/tr>\n
53<\/td>\n6.6\u2002DWR cell naming <\/td>\n<\/tr>\n
54<\/td>\n6.7\u2002DWR cell examples <\/td>\n<\/tr>\n
57<\/td>\n6.8\u2002Wrapper states <\/td>\n<\/tr>\n
58<\/td>\n7.\u2002Flexible parallel port
7.1\u2002General introduction <\/td>\n<\/tr>\n
61<\/td>\n7.2\u2002FPP lane examples <\/td>\n<\/tr>\n
63<\/td>\n7.3\u2002Structure of the FPP <\/td>\n<\/tr>\n
67<\/td>\n7.4\u2002Allocation of FPP configuration elements to the FPP lane control terminals
8.\u2002IEEE Std 1838 DWR relationship with other standards <\/td>\n<\/tr>\n
69<\/td>\nAnnex A (informative) Bubble diagrams <\/td>\n<\/tr>\n
71<\/td>\nAnnex B (informative) Bibliography <\/td>\n<\/tr>\n
73<\/td>\nBack cover <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
IEEE<\/b><\/a><\/td>\n2019<\/td>\n73<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":397802,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2644],"product_tag":[],"class_list":{"0":"post-397798","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-ieee","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/397798","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/397802"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=397798"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=397798"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=397798"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}