BS 3934-5:1992

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Mechanical standardization of semiconductor devices – Recommendations for tape automated bonding (TAB) of integrated circuits

Published By	Publication Date	Number of Pages
BSI	1992	16

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or ‘chip carriers’.

Additional information

Status	Withdrawn
Title	Mechanical standardization of semiconductor devices – Recommendations for tape automated bonding (TAB) of integrated circuits
Replaces	BS 3934:1965, BS 3934:Addendum No. 5:1983, BS 3934:Addendum No. 4:1980, BS 3934:Addendum No. 6:1989, BS 3934:Addendum No. 3:1975, BS 3934:Addendum No. 2:1971, BS 3934:Addendum No. 1:1967
Publisher	BSI
Committee	EPL/47
Pages	16
Publication Date	1992-04-01
Withdrawn Date	1997-09-15
Replaced By	BS 3934-5:1997
ISBN	0 580 20250 X
Standard Number	BS 3934-5:1992, IEC 60191-5:1987
Identical National Standard Of	IEC 60191-5:1987
Descriptors	Integrated circuits, Perforations, Assembling, Tape, Mechanical behaviour of materials, Electrical connections, Mechanical properties of materials, Flexible materials, Electronic equipment and components, Spaced, Standardization, Dimensions, Semiconductor devices, Bonding
ICS Codes	31.080.01 - Semiconductor devices in general

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BS 3934-5:1992

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