BS EN 60068-2-13:1999

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Environmental testing. Test methods – Tests. Test M. Low air pressure

Published By	Publication Date	Number of Pages
BSI	1999	12

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Additional information

Status	Withdrawn
Title	Environmental testing. Test methods – Tests. Test M. Low air pressure
Replaces	BS 2011-2.1M:1984
Publisher	BSI
Committee	GEL/104
Pages	12
Publication Date	1999-09-15
Withdrawn Date	2024-06-07
Replaced By	BS EN IEC 60068-2-13:2021
ISBN	0 580 32945 3
Standard Number	BS EN 60068-2-13:1999, IEC 60068-2-13:1983
Identical National Standard Of	EN 60068-2-13:1999, IEC 60749-14:2003, IEC 60068-2-13
Descriptors	Electrical equipment, Environmental testing, Electronic equipment and components, Testing conditions, Test duration, Visual inspection (testing), Pressure testing, Air, Low-pressure tests, Electrical components, Atmospheric pressure, Test pressure
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60068-2-13:1999

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