BS EN 60749-22:2003

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Semiconductor devices. Mechanical and climatic test methods – Bond strength

Published By	Publication Date	Number of Pages
BSI	2003	24

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Categories: 29.100.10 - Magnetic components, BSI

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Description

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.

Additional information

Status	Definitive
Pages	24
Publication Date	2003-07-04
ISBN	0 580 42199 6
Standard Number	BS EN 60749-22:2003
Title	Semiconductor devices. Mechanical and climatic test methods – Bond strength
Identical National Standard Of	IEC 60749-22:2002, EN 60749-22:2003, IEC 62317-9:2006/AMD1:2007
Replaces	BS EN 60749:1999
Descriptors	Climate, Bonding, Electronic equipment and components, Environmental testing, Mechanical testing, Integrated circuits, Strength of materials, Semiconductor devices
Publisher	BSI
Committee	EPL/47
ICS Codes	29.100.10 - Magnetic components

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BS EN 60749-22:2003

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