BS EN 61191-3:2017

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Printed board assemblies – Sectional specification. Requirements for through-hole mount soldered assemblies

Published By	Publication Date	Number of Pages
BSI	2017	26

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Description

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Additional information

Status	Definitive
Pages	26
Publication Date	2017-09-25
ISBN	978 0 580 91722 6
Standard Number	BS EN 61191-3:2017
Title	Printed board assemblies – Sectional specification. Requirements for through-hole mount soldered assemblies
Identical National Standard Of	EN 61191-3:2017, IEC 61191-3:2017
Replaces	BS EN 61191-3:1999
Descriptors	Printed-circuit boards, Electrical components, Joints, Printed circuits, Soldering, Holes, Wires, Boards, Microassembling, Electrical equipment, Defects, Surface properties, Electronic equipment and components, Integrated circuits, Semiconductor devices
Publisher	BSI
Committee	EPL/501
ICS Codes	31.240 - Mechanical structures for electronic equipment

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BS EN 61191-3:2017

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