BS EN 60191-6-4:2003

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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)

Published By	Publication Date	Number of Pages
BSI	2003	20

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Status	Definitive
Pages	20
Publication Date	2003-08-04
ISBN	0 580 42356 5
Standard Number	BS EN 60191-6-4:2003
Title	Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)
Identical National Standard Of	IEC 60191-6-4:2003, EN 60191-6-4 (IEC 60191-6-4:2003) AS
Descriptors	Surface mounting devices, Standardization, Integrated circuits, Electronic equipment and components, Semiconductor technology, Semiconductor devices, Dimensions, Drawings, Engineering drawings
Publisher	BSI
Committee	EPL/47
ICS Codes	31.080.01 - Semiconductor devices in general


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