BS EN 60191-6-6:2001
$102.76
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine pitch land grid array (FLGA) – Proposed amendment on terminology
| Published By | Publication Date | Number of Pages |
| BSI | 2001 | 16 |
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
