BS EN 60317-56:2012
$86.31
Specifications for particular types of winding wires – Solderable fully insulated (FIW) zero-defect polyurethane enamelled round copper wire, with nominal conductor diameter of 0,040 mm to 1,600 mm, class 180
| Published By | Publication Date | Number of Pages |
| BSI | 2012 | 13 |
This part of IEC 60317 specifies the requirements of solderable fully insulated (FIW) zero-defect enamelled round copper wire, class 180, with a single coating based on polyurethane resin, which may be modified providing it retains its chemical identity and satisfies all the required technical specifications.
The range of nominal conductor diameters of the wires covered by this standard is as follows:
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Grade of FIW 3 to FIW 08: 0,040 mm up to and including 0,067 mm;
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Grade of FIW 3 to FIW 09: 0,071 mm up to and including 0,355 mm;
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Grade of FIW 3 to FIW 08: 0,375 mm up to and including 0,475 mm;
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Grade of FIW 3 to FIW 07: 0,500 mm up to and including 0,750 mm;
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Grade of FIW 3 to FIW 06: 0,800 mm up to and including 1,000 mm;
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Grade of FIW 3 to FIW 05: 1,060 mm up to and including 1,600 mm.
The nominal conductor diameters are specified in IEC 60317-0-7.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 7 | INTRODUCTION |
| 8 | 1 Scope 2 Normative references 3 Terms and definitions, general notes and appearance |
| 9 | 4 Dimensions 5 Electrical resistance 6 Elongation 7 Springiness 8 Flexibility and adherence 9 Heat shock 10 Cut-Through 11 Resistance to abrasion (for nominal diameters of 0,250 mm up to and including 1,000 mm) |
| 10 | 12 Resistance to solvents 13 Breakdown voltage 14 Continuity of insulation 15 Temperature index 16 Resistance to refrigerants Table 1 – Resistance to abrasion |
| 11 | 17 Solderability 18 Heat or solvent bonding 19 Dielectric dissipation factor 20 Resistance to transformer oil 21 Loss of mass 23 Pin-hole test 30 Packaging |
