BS EN 61191-3:1999

$102.76

Printed board assemblies – Sectional specification. Requirements for through-hole mount soldered assemblies

Published By	Publication Date	Number of Pages
BSI	1999	18

Guaranteed Safe Checkout

Category: BSI

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

Applies to assemblies that are totally lead and hole, through-hole mounting technology (THT), or to the THT portions of assemblies that include other related technologies.

Additional information

Status	Withdrawn
Pages	18
Publication Date	1999-01-15
Withdrawn Date	2017-09-25
Replaced By	BS EN 61191-3:2017
ISBN	0 580 30840 5
Standard Number	BS EN 61191-3:1999, IEC 61191-3:1998
Title	Printed board assemblies – Sectional specification. Requirements for through-hole mount soldered assemblies
Descriptors	Defects, Semiconductor devices, Electrical equipment, Electronic equipment and components, Electrical components, Holes, Integrated circuits, Printed circuits, Boards, Surface properties, Wires, Microassembling, Joints, Printed-circuit boards, Soldering
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

Preview PDF

BS EN 61191-3:1999

$102.76


PDF Format	Searchable	Printable	Preview Now