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BS EN 62884-1:2017

BS EN 62884-1:2017

$198.66

Measurement techniques of piezoelectric, dielectric and electrostatic oscillators – Basic methods for the measurement

Published By Publication Date Number of Pages
BSI 2017 68
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This part of IEC 62884 specifies the measurement techniques for piezoelectric, dielectric and electrostatic oscillators, including Dielectric Resonator Oscillators (DROs) and oscillators using FBAR (hereinafter referred to as “Oscillator”).

NOTE Dielectric Resonator Oscillators (DROs) and oscillators using FBAR are under consideration.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
7 CONTENTS
11 FOREWORD
13 1 Scope
2 Normative references
14 3 Terms and definitions
3.1 General
15 3.2 Terms and definitions
4 Test and measurement procedures
4.1 General
4.2 Test and measurement conditions
4.2.1 Standard conditions for testing
4.2.2 Equilibrium conditions
4.2.3 Air flow conditions for temperature tests
16 4.2.4 Power supplies
4.2.5 Precision of measurement
4.2.6 Precautions
4.2.7 Alternative test methods
4.3 Visual inspection
4.3.1 General
4.3.2 Visual test A
4.3.3 Visual test B
17 4.3.4 Visual test C
4.4 Dimensions and gauging procedures
4.4.1 Dimensions – Test A
4.4.2 Dimensions – Test B
4.5 Electrical test procedures
4.5.1 Insulation resistance
4.5.2 Voltage proof
Figures
Figure 1 – Test circuits for insulation resistance measurements
18 4.5.3 Input power
Figure 2 – Test circuit for voltage proof test
Figure 3 – Test circuit for oscillator input power measurement
19 4.5.4 Output frequency
Figure 4 – Test circuit for oven and oscillator input power measurement
20 4.5.5 Frequency/temperature characteristics
Figure 5 – Test circuit for measurement of output frequency, method1
Figure 6 – Test circuit for measurement of output frequency, method 2
21 4.5.6 Frequency/load coefficient
Figure 7 – Test circuit for measurement of frequency/temperature characteristics
22 4.5.7 Frequency/voltage coefficient
4.5.8 Frequency stability with thermal transient
23 4.5.9 Oscillation start-up
Figure 8 – Thermal transient behaviour of typical oscillator
24 Figure 9 – Generalized oscillator circuit
25 Figure 10 – Test circuit for start-up behaviour and start-up time measurement
Figure 11 – Typical start-up behaviour with slow supply voltage ramp
26 Figure 12 – Definition of start-up time
27 4.5.10 Stabilization time
4.5.11 Frequency adjustment range
4.5.12 Retrace characteristics
Figure 13 – Supply voltage waveform for periodical tSU measurement
Figure 14 – Typical oscillator stabilization characteristic
28 4.5.13 Oscillator output voltage (sinusoidal)
Figure 15 – Example of retrace characteristic
29 4.5.14 Oscillator output voltage (pulse waveform)
Figure 16 – Test circuit for the measurement of output voltage
Figure 17 – Test circuit for the measurement of pulse outputs
Figure 18 – Characteristics of an output waveform
30 4.5.15 Oscillator output waveform (sinusoidal)
Figure 19 – Test circuit for harmonic distortion measurement
Figure 20 – Quasi-sinusoidal output waveforms
31 Figure 21 – Frequency spectrum for harmonic distortion
32 4.5.16 Oscillator output waveform (pulse)
4.5.17 Oscillator output power (sinusoidal)
4.5.18 Oscillator output impedance (sinusoidal)
33 4.5.19 Re-entrant isolation
4.5.20 Output suppression of gated oscillators
Figure 22 – Test circuit for the determination of isolation between output ports
34 4.5.21 3-state output characteristics
Figure 23 – Test circuit for measuring suppression of gated oscillators
Figure 24 – Test circuit for 3-state disable mode output current
35 4.5.22 Amplitude modulation characteristics
Figure 25 – Test circuit for output gating time – 3-state
36 Figure 26 – Test circuit for modulation index measurement
Figure 27 – Modulation waveform for index calculation
Figure 28 – Logarithmic signal amplitude scale
38 Figure 29 – Test circuit to determine amplitude modulation sensitivity
Figure 30 – Frequency spectrum of amplitude modulation distortion
39 Figure 31 – Test circuit to determine pulse amplitude modulation
40 Figure 32 – Pulse modulation characteristic
41 4.5.23 Frequency modulation characteristics
Figure 33 – Test circuit for the determination of modulation input impedance
Figure 34 – Test circuit for the measurement of f.m. deviation
43 Figure 35 – Test circuit for the measurement of f.m. sensitivity
44 Figure 36 – Test circuit for the measurement of frequency modulation distortion
45 4.5.24 Spurious response
4.5.25 Phase noise
Figure 37 – Test circuit for the measurement of single-sideband phase noise
46 4.5.26 Phase noise – vibration
4.5.27 Phase noise – acoustic
47 4.5.28 Noise pedestal
Figure 38 – Typical noise pedestal spectrum
48 4.5.29 Spectral purity
4.5.30 Incidental frequency modulation
49 4.5.31 RMS fractional frequency fluctuations
Figure 39 – Test circuit for the measurement of incidental frequency modulation
50 Figure 40 – Test circuit for method 1
51 Figure 41 – Test circuit for method 2
52 Figure 42 – Circuit modifications for methods 1 and 2
53 4.5.32 Electromagnetic interference (radiated)
Figure 43 – Time-domain short-term frequency stability of a typical 5 MHz precision oscillator
54 Figure 44 – Radiated interference tests
55 Figure 45 – Characteristics of line impedance of stabilizing network
56 Figure 46 – Circuit diagram of line impedance of stabilizing network
57 4.6 Mechanical and environmental test procedures
4.6.1 Robustness of terminations (destructive)
Tables
Table 1 – Measuring sets bandwidth
Table 2 – Tensile force
58 Table 3 – Thrust force
Table 4 – Bending force
59 4.6.2 Sealing test (non-destructive)
4.6.3 Soldering (solderability and resistance to soldering heat) (destructive)
Table 5 – Torque force
60 Figure 47 – Reflow temperature profile for solderability
Table 6 – Solderability – Test condition, reflow method
61 Figure 48 – Reflow temperature profile for resistance to soldering heat
62 4.6.4 Rapid change of temperature: severe shock by liquid immersion (non- destructive)
4.6.5 Rapid change of temperature: thermal shock in air (non-destructive)
4.6.6 Bump (destructive)
Table 7 – Resistance to soldering heat – Test condition and severity, reflow method
63 4.6.7 Vibration (destructive)
4.6.8 Shock (destructive)
64 4.6.9 Free fall (destructive)
4.6.10 Acceleration, steady-state (non-destructive)
4.6.11 Acceleration – 2g tip over
4.6.12 Acceleration noise
4.6.13 Low air pressure (non-destructive)
4.6.14 Dry heat (non-destructive)
4.6.15 Damp heat, cyclic (destructive)
65 4.6.16 Cold (non-destructive)
4.6.17 Climatic sequence (destructive)
4.6.18 Damp heat, steady-state (destructive)
4.6.19 Salt mist, cyclic (destructive)
4.6.20 Mould growth (non-destructive)
4.6.21 Immersion in cleaning solvent (non-destructive)
4.6.22 Radiation hardness
66 Bibliography

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BS EN 62884-1:2017
$198.66