BS EN ISO 9455-17:2024 – TC
$186.33
Tracked Changes. Soft soldering fluxes. Test methods – Surface insulation resistance comb test and electrochemical migration test of flux residues
Published By | Publication Date | Number of Pages |
BSI | 2024 | 69 |
This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
PDF Catalog
PDF Pages | PDF Title |
---|---|
1 | 30486924 |
40 | A-30450738 |
41 | undefined |
53 | 7.1 Surface plating 7.1.1 Slivering (thin metal overhang on etch runs) |
54 | 7.1.2 Plating nodules 7.1.3 Plating pits 7.2 Surface laminate 8.1 Preparation of the flux test solution 8.1.1 Liquid flux samples 8.1.2 Solid flux samples 8.1.3 Flux-cored solder wire or preform samples |
55 | 8.1.4 Solder paste samples 8.1.5 Paste flux samples 8.2 Preparation of the test coupons 8.2.1 Sample identification 8.2.2 Test coupons |
56 | 8.2.3 Test coupon pre-cleaning 9.1 Methods for connecting test coupons 9.1.1 Board circuitry layout |
58 | 9.1.2 Preconditioning of SIR test coupons prior to processing (optional) 9.2 Fluxing and soldering test patterns 9.2.1 Liquid and solid flux samples and flux-cored solder wire samples 9.2.2 Soldering using wave solder system 9.2.3 Soldering using static solder pot |
59 | 9.2.4 Solder paste samples 9.2.5 Paste flux samples 9.3 Cleaning |
60 | 9.4 SIR measurement 9.4.1 High-resistance measurement system verification 9.4.2 Test coupon measurements 9.5 Electrochemical migration test |