BS ISO 26262-11:2018:2019 Edition
$215.11
Road vehicles. Functional safety – Guidelines on application of ISO 26262 to semiconductors
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 190 |
This document is intended to be applied to safety-related systems that include one or more electrical and/or electronic (E/E) systems and that are installed in series production road vehicles, excluding mopeds. This document does not address unique E/E systems in special vehicles such as E/E systems designed for drivers with disabilities.
NOTE Other dedicated application-specific safety standards exist and can complement the ISO 26262 series of standards or vice versa.
Systems and their components released for production, or systems and their components already under development prior to the publication date of this document, are exempted from the scope of this edition. This document addresses alterations to existing systems and their components released for production prior to the publication of this document by tailoring the safety lifecycle depending on the alteration. This document addresses integration of existing systems not developed according to this document and systems developed according to this document by tailoring the safety lifecycle.
This document addresses possible hazards caused by malfunctioning behaviour of safety-related E/E systems, including interaction of these systems. It does not address hazards related to electric shock, fire, smoke, heat, radiation, toxicity, flammability, reactivity, corrosion, release of energy and similar hazards, unless directly caused by malfunctioning behaviour of safety-related E/E systems.
This document describes a framework for functional safety to assist the development of safety-related E/E systems. This framework is intended to be used to integrate functional safety activities into a company-specific development framework. Some requirements have a clear technical focus to implement functional safety into a product; others address the development process and can therefore be seen as process requirements in order to demonstrate the capability of an organization with respect to functional safety.
This document does not address the nominal performance of E/E systems.
This document has an informative character only. It contains possible interpretations of other parts of ISO 26262 with respect to semiconductor development. The content is not exhaustive with regard to possible interpretations, i.e., other interpretations can also be possible in order to fulfil the requirements defined in other parts of ISO 26262.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 7 | Foreword |
| 8 | Introduction |
| 11 | 1 Scope 2 Normative references 3 Terms and definitions |
| 12 | 4 A semiconductor component and its partitioning 4.1 How to consider semiconductor components 4.1.1 Semiconductor component development 4.2 Dividing a semiconductor component in parts |
| 13 | 4.3 About hardware faults, errors and failure modes 4.3.1 Fault models |
| 14 | 4.3.2 Failure modes 4.3.3 The distribution of base failure rate across failure modes |
| 15 | 4.4 About adapting a semiconductor component safety analysis to system level |
| 16 | 4.5 Intellectual Property (IP) 4.5.1 About IP |
| 17 | 4.5.2 Category and safety requirements for IP |
| 19 | 4.5.3 IP lifecycle |
| 21 | 4.5.4 Work products for IP |
| 24 | 4.5.5 Integration of black-box IP |
| 25 | 4.6 Base failure rate for semiconductors 4.6.1 General notes on base failure rate estimation |
| 30 | 4.6.2 Permanent base failure rate calculation methods |
| 51 | 4.7 Semiconductor dependent failure analysis 4.7.1 Introduction to DFA |
| 52 | 4.7.2 Relationship between DFA and safety analysis 4.7.3 Dependent failure scenarios |
| 55 | 4.7.4 Distinction between cascading failures and common cause failures 4.7.5 Dependent failure initiators and mitigation measures |
| 61 | 4.7.6 DFA workflow |
| 64 | 4.7.7 Examples of dependent failures analysis |
| 65 | 4.7.8 Dependent failures between software element and hardware element 4.8 Fault injection 4.8.1 General 4.8.2 Characteristics or variables of fault injection |
| 67 | 4.8.3 Fault injection results 4.9 Production and Operation 4.9.1 About Production |
| 68 | 4.9.2 Production Work Products 4.9.3 About service (maintenance and repair), and decommissioning 4.10 Interfaces within distributed developments |
| 69 | 4.11 Confirmation measures 4.12 Clarification on hardware integration and verification |
| 70 | 5 Specific semiconductor technologies and use cases 5.1 Digital components and memories 5.1.1 About digital components 5.1.2 Fault models of non-memory digital components |
| 71 | 5.1.3 Detailed fault models of memories |
| 72 | 5.1.4 Failure modes of digital components 5.1.5 Example of failure mode definitions for common digital blocks |
| 76 | 5.1.6 Qualitative and quantitative analysis of digital component |
| 77 | 5.1.7 Notes on quantitative analysis of digital components |
| 79 | 5.1.8 Example of quantitative analysis |
| 80 | 5.1.9 Example of techniques or measures to detect or avoid systematic failures during design of a digital component |
| 84 | 5.1.10 Verification using fault injection simulation |
| 85 | 5.1.11 Example of safety documentation for a digital component |
| 86 | 5.1.12 Examples of safety mechanisms for digital components and memories |
| 87 | 5.1.13 Overview of techniques for digital components and memories |
| 90 | 5.2 Analogue/mixed signal components 5.2.1 About analogue and mixed signal components |
| 92 | 5.2.2 Analogue and mixed signal components and failure modes |
| 101 | 5.2.3 Notes about safety analysis |
| 104 | 5.2.4 Examples of safety mechanisms |
| 107 | 5.2.5 Avoidance of systematic faults during the development phase |
| 110 | 5.2.6 Example of safety documentation for an analogue/mixed-signal component |
| 111 | 5.3 Programmable logic devices 5.3.1 About programmable logic devices |
| 115 | 5.3.2 Failure modes of PLD |
| 116 | 5.3.3 Notes on safety analyses for PLDs |
| 122 | 5.3.4 Examples of safety mechanisms for PLD |
| 123 | 5.3.5 Avoidance of systematic faults for PLD |
| 126 | 5.3.6 Example of safety documentation for a PLD 5.3.7 Example of safety analysis for PLD 5.4 Multi-core components 5.4.1 Types of multi-core components |
| 127 | 5.4.2 Implications of ISO 26262 series of standards for multi-core components |
| 129 | 5.5 Sensors and transducers 5.5.1 Terminology of sensors and transducers |
| 130 | 5.5.2 Sensors and transducers failure modes |
| 135 | 5.5.3 Safety analysis for sensors and transducers |
| 136 | 5.5.4 Examples of safety measures for sensors and transducers |
| 140 | 5.5.5 About avoidance of systematic faults for sensors and transducers |
| 141 | 5.5.6 Example of safety documentation for sensors and transducers |
| 142 | Annex A (informative) Example on how to use digital failure modes for diagnostic coverage evaluation |
| 146 | Annex B (informative) Examples of dependent failure analysis |
| 160 | Annex C (informative) Examples of quantitative analysis for a digital component |
| 165 | Annex D (informative) Examples of quantitative analysis for analogue component |
| 179 | Annex E (informative) Examples of quantitative analysis for PLD component |
| 185 | Bibliography |
