BSI 19/30398273 DC:2019 Edition
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BS EN ISO 9453. Soft solder alloys. Chemical compositions and forms
Published By | Publication Date | Number of Pages |
BSI | 2019 | 20 |
This International Standard specifies the requirements for chemical composition for soft solder alloys containing two or more of:
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tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.