IEC 60191-4:2013
$68.90
Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Published By | Publication Date | Number of Pages |
IEC | 2013-10-10 | 52 |
If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
Published Code | IEC |
---|---|
Published By | International Electrotechnical Commission |
Publication Date | 2013-10-10 |
Pages Count | 52 |
Language | France |
Edition | 3.0 |
File Size | 1.2 MB |
ICS Codes | 31.080.01 - Semiconductor devices in general |
Related products
-
BS EN 61191-2:2017:2019 Edition
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publication…
-
BS IEC 60191-2:1966+A20:2018
Mechanical standardization of semiconductor devices – Dimensions Published By Publication Date Number of Pages BSI…
-
BSI 13/30290462 DC:2013 Edition
BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation…
-
IEC 60194-1:2021
Printed boards design, manufacture and assembly – Vocabulary – Part 1: Common usage in printed…
-
BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices – Measurement methods of the package warpage at elevated temperature…
-
BS EN 60691:2003+A2:2010
Thermal-links. Requirements and application guide Published By Publication Date Number of Pages BSI 2010 44
-
BS EN 60191-6-4:2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60691:2016+A1:2019
Thermal-links. Requirements and application guide Published By Publication Date Number of Pages BSI 2019 54
-
BS EN 61249-4-18:2013:2014 Edition
Materials for printed boards and other interconnecting structures – Sectional specification set for prepreg materials,…
-
BS EN 60191-4:2000:2003 Edition
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines…
-
BS EN 60191-6-13:2016
Mechanical standardization of semiconductor devices – Design guideline of open-top-type sockets for Fine-pitch Ball Grid…
-
BS EN 61191-2:2017
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publication…
-
BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices – Measurement methods of the package warpage at elevated temperature…
-
BSI 13/30284029 DC:2013 Edition
BS EN 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor tests and…
-
BS EN 60691:2016
Thermal-links. Requirements and application guide Published By Publication Date Number of Pages BSI 2016 50
-
IEC 61191-4:2017
Printed board assemblies – Part 4: Sectional specification – Requirements for terminal soldered assemblies Published…
-
BS EN 60286-4:2013
Packaging of components for automatic handling – Stick magazines for electronic components encapsulated in packages…
-
BS EN 61191-4:2017
Printed board assemblies – Sectional specification. Requirements for terminal soldered assemblies Published By Publication Date…
-
BS EN 61191-2:2017:2019 Edition
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publication…
-
BS EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures – Reinforced base materials clad and unclad.…
-
BS EN 60191-6-20:2010
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines…
-
BS EN 60191-6-13:2007:2008 Edition
Mechanical standardization of semiconductor devices – Design guideline of open-top-type sockets for fine-pitch ball grid…
-
BS EN 60191-6-21:2010
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 61191-2:2013
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publication…
-
IEC 60191-6-13:2016
Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch…
-
BS EN 60191-6-18:2010
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60601-2-66:2015
Medical electrical equipment – Particular requirements for the basic safety and essential performance of hearing…
-
BSI 13/30290470 DC:2013 Edition
BS EN 60191-2 Proposed new package outline. P-ZMP-P89 Published By Publication Date Number of Pages…
-
BS EN IEC 62149-11:2020
Fibre optic active components and devices. Performance standards – Multiple channel transmitter/receiver chip scale package…
-
BS EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures – Reinforced base materials clad and unclad.…
-
BS EN 60191-6-2:2002:2003 Edition
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60191-6-20:2010
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 61249-4-18:2013:2014 Edition
Materials for printed boards and other interconnecting structures – Sectional specification set for prepreg materials,…
-
IEC 60191-6-4:2003
Normalisation mécanique des dispositifs à semiconducteurs – Partie 6-4: Règles générales pour la préparation des…
-
BS EN 61191-2:2017:2019 Edition
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publication…
-
BS EN 60191-6-22:2013
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines…
-
BS EN 61191-1:2013
Printed board assemblies – Generic specification. Requirements for soldered electrical and electronic assemblies using surface…
-
BS EN 60191-6-18:2010
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…