IEC 60191-6-1:2001
$7.15
Mechanical standardization of semiconductor devices – Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for gull-wing lead terminals
| Published By | Publication Date | Number of Pages |
| IEC | 2001-10-29 | 14 |
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
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