IEC 60191-6-19:2010
$22.75
Normalisation mécanique des dispositifs à semiconducteurs – Partie 6-19 : méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible
| Published By | Publication Date | Number of Pages |
| IEC | 2010-02-25 | 30 |
| Published Code | IEC |
|---|---|
| Published By | International Electrotechnical Commission |
| Publication Date | 2010-02-25 |
| Pages Count | 30 |
| Language | France |
| Edition | 1.0 |
| File Size | 1.1 MB |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
Related products
-
BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices – Measurement methods of the package warpage at elevated temperature…
-
BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices – Measurement methods of the package warpage at elevated temperature…
