IEC 61191-3:2017

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Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies

Published By	Publication Date	Number of Pages
IEC	2017-05-30	44

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Categories: 31.240 - Mechanical structures for electronic equipment, IEC

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Description

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2017-05-30
Pages Count	44
Language	France
Edition	2.0
File Size	1.5 MB
ICS Codes	31.240 - Mechanical structures for electronic equipment

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IEC 61191-3:2017

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