{"id":124233,"date":"2024-10-19T04:54:46","date_gmt":"2024-10-19T04:54:46","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/astm-f1709\/"},"modified":"2024-10-24T23:09:40","modified_gmt":"2024-10-24T23:09:40","slug":"astm-f1709","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/astm\/astm-f1709\/","title":{"rendered":"ASTM-F1709"},"content":{"rendered":"<\/p>\n
1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.<\/p>\n
1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.<\/p>\n
1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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1<\/td>\n | Scope Referenced Documents Terminology Classification Ordering Information Impurities TABLE 1 TABLE 2 <\/td>\n<\/tr>\n | ||||||
2<\/td>\n | Grain Size Configuration Workmanship, Finish, Appearance Sampling Analytical Methods Certification Packaging Keywords <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" F1709-97(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications<\/b><\/p>\n |