This part of IEC 60539 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties.<\/p>\n
It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 4<\/td>\n | European foreword Endorsement notice <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | Annex ZA (normative) Normative references to international publications with their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | Figures Figure 1 \u2013 Typical resistance-temperature characteristic for NTC thermistors <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | Figure 2 \u2013 Decreased power dissipation curve <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | Figure 3 \u2013 Maximum current derating <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 4 General items 4.1 Units and symbols 4.2 Preferred values and appropriate category 4.2.1 General 4.2.2 Appropriate category 4.3 Marking 4.3.1 General Tables Table 1 \u2013 Lower and upper category temperatures and duration of the damp heat, steady state test <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 4.3.2 Marking for small size types such as surface mount thermistors 4.3.3 Coding 4.4 Quality assessment procedures 5 Test and measurement procedures 5.1 General 5.2 Standard atmospheric conditions for testing <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 5.3 Drying and recovery 5.3.1 Drying 5.3.2 Recovery 5.4 Mounting (for surface mount thermistors only) 5.4.1 General 5.4.2 Substrate and pad 5.4.3 Mounting on board <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 5.5 Visual examination and check of dimensions 5.5.1 Visual examination <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 5.5.2 Dimensions 5.6 Zero-power resistance 5.6.1 General 5.6.2 Measurement procedures 5.6.3 Requirements Figure 4 \u2013 Basic circuit for zero-power resistance measurement <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 5.7 B-value or resistance ratio 5.7.1 General 5.7.2 Requirements 5.8 Insulation resistance (for insulated types only) 5.8.1 General 5.8.2 Test methods Figure 5 \u2013 Example of Method 1 for testing the insulation resistance <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | Figure 6 \u2013 Example of Method 2 for testing the insulation resistance (1) Figure 7 \u2013 Example of Method 2 for testing the insulation resistance (2) <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | 5.8.3 Applied voltage Figure 8 \u2013 Example of Method 3 for testing the insulation resistance Figure 9 \u2013 Example of Method 4 for testing the insulation resistance <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | 5.8.4 Requirements 5.9 Voltage proof (for insulated types only) 5.9.1 General 5.9.2 Test voltage 5.9.3 Requirements 5.10 Resistance\/temperature characteristic 5.10.1 General 5.10.2 Test methods 5.10.3 Requirements 5.11 Dissipation factor (\u03b4) 5.11.1 General <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | 5.11.2 Initial measurements 5.11.3 Test methods Figure 10 \u2013 Example of test chamber <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | 5.11.4 Requirements 5.12 Thermal time constant by ambient temperature change (\u03c4a) 5.12.1 The hot to cold thermal time constant for ambient temperature change Figure 11 \u2013 Dissipation factor measuring circuit <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | 5.12.2 The cold to hot thermal time constant for ambient temperature change 5.12.3 Final measurements and requirements 5.12.4 Requirements 5.13 Thermal time constant by cooling after self-heating (\u03c4c) 5.13.1 General 5.13.2 Initial measurements <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | 5.13.3 Preconditioning 5.13.4 Test method 5.13.5 Final measurements and requirements Figure 12 \u2013 Thermal time constant measuring circuit <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | 5.14 Robustness of terminations (not applicable to surface mount thermistors) 5.14.1 General 5.14.2 Initial measurements 5.14.3 Test methods 5.14.4 Test Ua1 \u2013 Tensile 5.14.5 Test Ub \u2013 Bending (half the number of terminations) 5.14.6 Test Uc \u2013 Torsion (remaining terminations) Table 2 \u2013 Tensile force <\/td>\n<\/tr>\n | ||||||
| 39<\/td>\n | 5.14.7 Final measurements and requirements 5.15 Resistance to soldering heat 5.15.1 General 5.15.2 Preconditioning 5.15.3 Test procedure 5.15.4 Recovery 5.15.5 Final inspection, measurement and requirements <\/td>\n<\/tr>\n | ||||||
| 40<\/td>\n | 5.16 Solderability 5.16.1 General 5.16.2 Test procedure 5.16.3 Final inspection, measurements and requirements 5.17 Rapid change of temperature 5.17.1 General 5.17.2 Initial measurements 5.17.3 Test procedures <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | 5.17.4 Final inspection, measurements and requirements 5.18 Vibration 5.18.1 General 5.18.2 Initial measurements 5.18.3 Test procedures 5.18.4 Final inspection, measurements and requirements <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | 5.19 Shock 5.19.1 General 5.19.2 Initial measurements 5.19.3 Mounting 5.19.4 Test procedures 5.19.5 Final inspection, measurements and requirements 5.20 Free fall 5.20.1 General 5.20.2 Initial measurements 5.20.3 Test procedures 5.20.4 Final inspection, measurements and requirements 5.21 Thermal shock 5.21.1 General <\/td>\n<\/tr>\n | ||||||
| 43<\/td>\n | 5.21.2 Initial measurements 5.21.3 Test procedures 5.21.4 Final inspection, measurements and requirements 5.22 Cold 5.22.1 General 5.22.2 Initial measurements 5.22.3 Test procedures <\/td>\n<\/tr>\n | ||||||
| 44<\/td>\n | 5.22.4 Final inspection, measurements and requirements 5.23 Dry heat 5.23.1 General 5.23.2 Initial measurements 5.23.3 Test procedures 5.23.4 Final inspection, measurements and requirements 5.24 Damp heat, steady state 5.24.1 General <\/td>\n<\/tr>\n | ||||||
| 45<\/td>\n | 5.24.2 Initial measurements 5.24.3 Test procedures 5.24.4 Recovery 5.24.5 Final inspection, measurements and requirements 5.25 Endurance 5.25.1 General 5.25.2 Endurance at room temperature with applied continuous maximum current (Imax25) (for inrush current-limiting thermistors only) <\/td>\n<\/tr>\n | ||||||
| 46<\/td>\n | 5.25.3 Endurance at room temperature with applied cyclic maximum current (Imax25) (for inrush current-limiting thermistors only) Figure 13 \u2013 Endurance at room temperature with Imax25 evaluating circuit <\/td>\n<\/tr>\n | ||||||
| 47<\/td>\n | 5.25.4 Endurance at T3 and Pmax <\/td>\n<\/tr>\n | ||||||
| 48<\/td>\n | 5.25.5 Endurance at upper category temperature <\/td>\n<\/tr>\n | ||||||
| 49<\/td>\n | 5.25.6 Maximum permissible capacitance (for inrush current-limiting thermistors only) Figure 14 \u2013 Maximum permissible capacitance test circuit (Method 1) <\/td>\n<\/tr>\n | ||||||
| 50<\/td>\n | 5.26 Shear (adhesion) test (for surface mount thermistors only) 5.26.1 General Figure 15 \u2013 Maximum permissible capacitance test circuit (Method 2) <\/td>\n<\/tr>\n | ||||||
| 51<\/td>\n | 5.26.2 Test conditions 5.26.3 Requirements 5.27 Substrate bending test (for surface mount thermistors only) 5.27.1 General 5.27.2 Initial measurements 5.27.3 Test procedures 5.27.4 Final inspection and requirements 5.28 Component solvent resistance 5.28.1 General <\/td>\n<\/tr>\n | ||||||
| 52<\/td>\n | 5.28.2 Initial measurements 5.28.3 Test conditions 5.28.4 Requirements 5.29 Solvent resistance of marking 5.29.1 General 5.29.2 Test conditions 5.29.3 Requirements 5.30 Salt mist 5.30.1 General 5.30.2 Test conditions 5.31 Sealing <\/td>\n<\/tr>\n | ||||||
| 53<\/td>\n | 5.32 Composite temperature\/humidity cycle 5.32.1 General 5.32.2 Initial measurements 5.32.3 Test conditions 5.32.4 Final inspection, measurements and requirements <\/td>\n<\/tr>\n | ||||||
| 54<\/td>\n | Annex A (normative) Interpretation of sampling plans and procedures as described in IEC 60410:1973 for use within quality assessment systems A.1 Clause and subclause numbers of IEC 60410:1973 <\/td>\n<\/tr>\n | ||||||
| 55<\/td>\n | Annex B (normative) Rules for the preparation of detail specifications for directly heated thermistors for electronic equipment for use within quality assessment systems B.1 Drafting B.2 Reference standard B.3 Circulation <\/td>\n<\/tr>\n | ||||||
| 56<\/td>\n | Annex C (informative) Typical examples of mountings for measurements ofdirectly heated thermistors C.1 Mounting for surface mount thermistors <\/td>\n<\/tr>\n | ||||||
| 57<\/td>\n | Figure C.1 \u2013 Mounting for measurements of surface mount thermistors <\/td>\n<\/tr>\n | ||||||
| 58<\/td>\n | Annex D (informative) Reference to IEC 60539-1:2008 <\/td>\n<\/tr>\n | ||||||
| 59<\/td>\n | Annex Q (normative) Quality assessment procedures Q.1 General Q.2 Primary stage of manufacture Q.3 Structurally similar components <\/td>\n<\/tr>\n | ||||||
| 60<\/td>\n | Q.4 Qualification approval procedures Q.4.1 General Q.4.2 Test procedure for qualification approval Q.4.3 Maintenance of qualification approval <\/td>\n<\/tr>\n | ||||||
| 61<\/td>\n | Q.5 Quality conformance inspection Q.6 Certified test records of released lots Q.7 Delayed delivery Q.8 Release for delivery under qualification approval before the completion of group B tests Q.9 Alternative test methods Q.10 Unchecked parameters <\/td>\n<\/tr>\n | ||||||
| 62<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Directly heated negative temperature coefficient thermistors – Generic specification<\/b><\/p>\n |