ASHRAE DesignConsiderationsforDatacomEquipmentCenters 2009
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Design Considerations for Datacom Equipment Centers, Second Edition
| Published By | Publication Date | Number of Pages |
| ASHRAE | 2009 | 224 |
The design of computer rooms and telecommunications facilities is different in fundamental ways from the design of facilities used primarily for human occupancy. ASHRAE has not, until now, published a basic reference text to provide an overview of the special design needs of datacom facilities. As the power density of datacom equipment continues to increase, this need has grown more severe.This book covers basic design considerations for data and communications equipment centers. The book is divided into two parts. Part I, Datacom Facility Basics, includes chapters on datacom design criteria (temperature, temperature rate of change, relative humidity, dew point, and filtration), HVAC load, computer room cooling (including both air and liquid cooling), and air distribution. Part II of the book, Other Considerations, includes chapters on ancillary spaces (battery plants, emergency generator rooms, burn-in rooms and test labs, and spare parts rooms), contamination, acoustical noise emissions, structural and seismic design and testing, fire detection and suppression, commissioning, availability and redundancy, and energy efficiency. This book does not cover electrical or electronic systems design and distribution.The primary changes for this second edition center on the updated thermal envelope and relate to the recommended temperatures at the inlets of the equipment operating in datacom facilities.This book is the third in the ASHRAE Datacom Series, authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Technology Spaces and Electronic Equipment. This series provides comprehensive treatment of datacom cooling and related subjects.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 15 | OVERVIEW OF CHAPTERS Part I: Datacom Facility Basics |
| 16 | Part II: Other Considerations |
| 20 | 2.1 Overview |
| 21 | 2.2 Environmental Requirements |
| 22 | Table 2.1 Class 1, Class 2, and NEBS Design Conditions 2.3 Temperature |
| 23 | Figure 2.1a Recommended data center Class 1, Class 2, and NEBS operating conditions. Refer to ASHRAE’s Thermal Guidelines, Second Edition (ASHRAE 2009) for an equivalent figure with SI units. |
| 24 | Figure 2.1b Allowable data center Class 1, Class 2, and NEBS operating conditions. Refer to ASHRAE’s Thermal Guidelines (ASHRAE 2009) for an equivalent figure with SI units. |
| 25 | Figure 2.2 Class 1, Class 2, and NEBS allowable temperature range vs. altitude. 2.4 Temperature Rate of Change |
| 26 | 2.5 Humidity 2.6 Filtration and Contamination |
| 27 | 2.7 Ventilation |
| 28 | 2.8 Envelope Considerations 2.9 Human Comfort |
| 29 | 2.10 Flexibility 2.11 Additional Considerations |
| 30 | 3.1 Datacom Equipment |
| 31 | 3.2 Equipment Loads, including High-Density Loads 3.2.1 Trends 3.2.2 Equipment Heat Load Calculations |
| 32 | 3.3 Electrical Distribution Equipment 3.4 Other Loads 3.4.1 Ventilation and Infiltration |
| 33 | Table 3.1 Sample Calculation—Overall Heat Loads Expected in a New Facility with Vintage 2005 Equipment |
| 34 | 3.4.2 Lights 3.4.3 People 3.4.4 Envelope 3.4.5 Transmission 3.4.6 Heating and Reheat 3.4.7 Humidification |
| 36 | 4.1 Computer Room Air-Conditioning (CRAC) Units 4.1.1 Cooling |
| 37 | 4.1.2 Location 4.1.3 Humidity Control 4.1.4 Ventilation |
| 38 | Figure 4.1 Datacom facility with dedicated outdoor air preconditioning. |
| 39 | 4.2 Central Station Air-Handling Units 4.2.1 Coil Selection 4.2.2 Humidification 4.2.3 Part-Load Efficiency and Energy Recovery 4.2.4 Flexibility/Redundancy Using VAV Systems |
| 40 | 4.3 Liquid Cooling |
| 41 | 4.4 Chilled-Water Distribution Systems Figure 4.2 Chilled-water loop distribution. |
| 42 | 4.5 Condenser Systems |
| 43 | 4.6 Refrigeration 4.7 Chillers |
| 44 | 4.8 Pumps 4.9 Piping |
| 45 | 4.10 Humidifiers 4.11 Controls and Monitoring 4.11.1 Controls |
| 46 | 4.11.2 Monitoring |
| 48 | 5.1 Introduction 5.2 Airflow Through Equipment 5.2.1 Design Conditions |
| 49 | 5.2.2 Once-Through Concept 5.2.3 Equipment Cooling Classes Figure 5.1 Recommended equipment airflow directivity protocols. |
| 50 | 5.2.4 Blanking Panels 5.2.5 Equipment Airflow 5.3 Airflow through Equipment Rooms 5.3.1 Hot-Aisle/Cold-Aisle Protocol |
| 51 | 5.3.2 Placement of Racks 5.3.3 Equipment Room Airflow 5.3.4 Cooling Effectiveness 5.4 CFD Modeling |
| 52 | 5.5 Room Cooling Classes (Protocols) 5.5.1 Syntax for RC-Classes 5.5.2 Vertical Underfloor (VUF) |
| 54 | Figure 5.2 Schematic of a datacom equipment room with underfloor raised-floor air space supply air distribution. |
| 56 | 5.5.3 Overhead (VOH) |
| 57 | Figure 5.3 Typical ducted ceiling distribution used in datacom facilities. |
| 59 | 5.5.4 Horizontal Displacement (HDP) 5.5.5 Horizontal Overhead (HOH) 5.5.6 Natural Convection Overhead (NOH) 5.5.7 Supplemental Cooling |
| 61 | 6.1 Liquid Cooling Overview 6.2 Datacom Facility Chilled-Water Systems |
| 62 | 6.3 Liquid-Cooled Computer Equipment |
| 63 | Figure 6.1 Internal liquid cooling loop restricted to within rack extents. |
| 64 | Figure 6.2 Internal liquid cooling loop within rack extents and external liquid cooling loop to racks. |
| 65 | Figure 6.3 Internal liquid cooling loop extended to liquid-cooled external modular cooling unit. |
| 66 | Figure 6.4 Hybrid rack cooling system—internal liquid cooling loop extended to liquid-cooled external modular cooling unit and rack air-cooled components. |
| 67 | Figure 6.5 Hybrid rack cooling system—rack level liquid cooling loop extended to liquid-cooled external modular cooling unit and rack air-cooled components. |
| 68 | Figure 6.6 Hybrid rack cooling system—rack level liquid cooling loop extended to liquid-cooled external modular cooling unit and rack air-cooled components. |
| 69 | 6.4 Cooling Liquids 6.4.1 Dielectric Fluids |
| 70 | 6.4.2 Water 6.4.3 Refrigerants |
| 71 | 6.5 Reliability |
| 74 | 7.1 Electrical Power Distribution Equipment |
| 75 | Figure 7.1 Typical electrical power distribution equipment block diagram. |
| 76 | 7.2 Battery Plants 7.2.1 Secondary Battery Plants |
| 77 | 7.2.2 Vented Lead-Acid (VLA) batteries |
| 78 | 7.2.3 Valve Regulated Lead-Acid (VRLA) Batteries |
| 79 | 7.2.4 Battery Rooms 7.3 Engine/Generator Rooms |
| 80 | 7.4 Burn-In Rooms and Test Labs 7.5 Datacom Equipment Spare Parts 7.6 Storage Spaces |
| 82 | 8.1 Introduction |
| 83 | 8.2 Contamination Classifications 8.2.1 Gases |
| 84 | Table 8.1 Characteristics of Corrosion Initiating Gases |
| 85 | 8.2.2 Solids |
| 86 | 8.2.3 Liquids |
| 87 | 8.3 Industry-Defined Limits and Test Methods for Contamination in IT Equipment Rooms Table 8.2 Corrosive Gas and Volatile Organic Industry Limits |
| 89 | Table 8.3 Telecommunication Particulate Contamination and Concentrations |
| 90 | 8.4 Facilities Design—General Considerations for Data Processing Environment Installations 8.4.1 Site Selection 8.4.2 Construction |
| 91 | 8.4.3 Fire Prevention 8.4.4 Raised-Floor Design |
| 93 | 8.4.5 Overhead Supply Air 8.4.6 Ceiling Panels 8.4.7 Temperature and Humidity Control |
| 94 | 8.4.8 Filtration |
| 95 | Table 8.4 Comparison of ASHRAE 52.1 and 52.2 Standards 8.4.9 Positive Pressurization |
| 96 | 8.4.10 IT Equipment Installation |
| 97 | 8.4.11 Operational Strategies |
| 98 | 8.4.12 Site Survey 8.5 Summary |
| 100 | 9.1 Acoustics |
| 101 | 9.2 ASHRAE Resources |
| 102 | 9.3 Three Aspects of the Noise Problem: The Source, Path, and Receiver |
| 103 | 9.4 The Effects of Noise on People |
| 104 | 9.5 The Sound Power Level of a Noise Source |
| 105 | 9.6 Limits on the Sound Power Levels of Datacom Equipment |
| 106 | 9.7 The Sound Pressure Level in a Room |
| 108 | 9.8 Limits on the Sound Pressure Levels in Datacom Facilities |
| 110 | 10.1 Building Floor Structure 10.1.1 Weight Distribution Area |
| 111 | 10.1.2 Floor Loading/Floor Load Rating 10.1.3 Floor Loading Calculation General Formulas |
| 112 | 10.1.4 Floor Loading Calculation Examples Figure 10.1 Weight distribution area. Reproduced with permission from IBM (2001). |
| 113 | 10.2 Access Floor Panels and Structure 10.2.1 Concentrated Load |
| 114 | 10.2.2 Uniform Load 10.2.3 Ultimate Load 10.2.4 Rolling Load 10.2.5 Stringer vs. Stringerless Understructure Systems |
| 115 | 10.2.6 Floor Panel Load Ratings 10.2.7 Access Floors in Seismic Areas 10.3 Datacom Equipment Installation in an Earthquake area |
| 117 | Figure 10.2 Rigid tie-down—turnbuckle assembly. Reproduced with permission from Notohardjono (2004). |
| 118 | Figure 10.3 Rigid tie-down—detail turnbuckle assembly. Reproduced with permission from Notohardjono (2003). |
| 119 | Figure 10.4 Overhead seismic rack snubber. |
| 120 | 11.1 FIRE ALARM SYSTEMS 11.1.1 Fire Detection Methodologies: Types of Detectors and Applications |
| 123 | 11.1.2 Applications of Smoke/Fire Detection Systems |
| 125 | 11.1.3 Basic Functions |
| 126 | 11.1.4 Notification Devices |
| 127 | 11.1.5 Manually Actuated Pull Station 11.1.6 Identification 11.1.7 System Documentation 11.1.8 Inspection, Testing, and Maintenance 11.2 FIRE SUPPRESSION SYSTEMS 11.2.1 Clean Agent Systems |
| 130 | 11.2.2 Water-Based Systems |
| 132 | 11.2.3 Fire Standpipe Systems |
| 133 | 11.3 FIRE BARRIER (FIRESTOP) APPLICATION 11.3.1 General 11.3.2 Firestop System Test Ratings 11.3.3 Firestop Materials 11.3.4 Penetration Types and Firestopping Applications |
| 134 | 11.4 MECHANICAL VENTILATION SYSTEMS 11.4.1 Smoke Control Purge Systems |
| 135 | 11.4.2 Fire Suppression Purge Systems |
| 136 | 12.1 Introduction |
| 137 | 12.2 Preliminary Documentation |
| 138 | 12.3 Commissioning Levels |
| 140 | 12.4 Commissioning Mission Critical Facilities |
| 141 | 12.5 Commissioning Costs 12.6 Summary |
| 142 | Table 12.1 Categories of Formal Commissioning Activities |
| 144 | 13.1 Availability Definitions |
| 146 | 13.2 Redundancy |
| 147 | 13.3 Diversity |
| 148 | 13.4 Human Error and Availability 13.5 Practical Examples |
| 150 | 14.1 Introduction |
| 151 | 14.2 Environmental Criteria |
| 152 | 14.3 Chilled-Water Plants 14.3.1 Water Chillers |
| 153 | 14.3.2 Chilled-Water Pumps 14.3.3 Condenser Water Pumps 14.3.4 Cooling Towers |
| 154 | 14.3.5 Controls 14.3.6 System Simulation and Optimization 14.4 CRAC Units: Generation |
| 155 | 14.5 Fans, Pumps, and Variable-Speed Drives 14.5.1 Fans |
| 156 | 14.5.2 Pumps |
| 157 | 14.5.3 Variable-Speed Drives 14.6 Humidity Control |
| 158 | 14.6.1 Dehumidification 14.7 Water-side Economizers |
| 160 | Figure 14.1 Direct water-side economizer. |
| 161 | Figure 14.2 Indirect water-side economizer. |
| 162 | 14.8 Air-side Economizers |
| 163 | Figure 14.3 Air-side economizer schematic. |
| 164 | 14.9 Outdoor Air Ventilation |
| 165 | 14.10 Part-Load Operation—Generation 14.11 In-Room Airflow Distribution |
| 166 | 14.12 CRAC Units—Distribution |
| 167 | 14.13 Part-Load Operation—Distribution 14.14 Datacom Equipment Energy Usage |
| 168 | 14.15 UPS Energy Efficiency |
| 169 | 14.16 Emerging Technologies 14.17 Controls and Energy Management |
| 170 | 14.18 System Energy Simulation |
| 175 | Figure A.1 2008 recommended environmental envelope (new Class 1 and 2). |
| 176 | Figure A.2 Inlet and component temperatures with fixed fan speed. |
| 177 | Figure A.3 Inlet and component temperatures with variable fan speed. |
