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ASTM-D5109:2012 Edition(Redline)

ASTM-D5109:2012 Edition(Redline)

$32.50

D5109-12 Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Redline)

Published By Publication Date Number of Pages
ASTM 2012 11
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Solder Float Test

8
Solvent Resistance

7
Flammability Rating Test

16
Permittivity

14
Flexural Strength, Flatwise at Elevated Temperature

15
Warp or Twist

6
Peel Strength Test at Elevated Temperature

10
Conditioning

4
Flexural Strength, Flatwise at Room Temperature

15
Procedure

Section
Purity of Copper

5
Thickness & Thickness Variation

18
Volume Resistivity

11
Dissipation Factor

14
Dielectric Breakdown Voltage Parallel to Laminations

13
Water Absorption

12
Scratches in Copper Surface

21
Pin Holes in Copper Surface

20
Referenced Documents

2
Surface Resistivity

11
Oven Blister Test

17
Terminology

3
Peel Strength Test at Room Temperature

9
Dimensional Instability

19
ICS Codes 83.140.20 - Laminated sheets

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