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BS EN 50310:2016 – TC:2020 Edition

BS EN 50310:2016 – TC:2020 Edition

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Tracked Changes. Telecommunications bonding networks for buildings and other structures

Published By Publication Date Number of Pages
BSI 2020 0
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To revise EN 50310:2010 in the light of the recent developments at ISO/IEC JTC 1 level. (EN 50310 was offered to JTC 1 and triggered the first internationally harmonized ISO/IEC deliverable).

PDF Catalog

PDF Pages PDF Title
89 European foreword
91 Introduction
92 Figure 1 – Schematic relationship between EN 50310 and other relevant standards
93 Table 1 – Contextual relationship between EN 50310 and other relevant standards
94 1 Scope
2 Normative references
95 3 Terms, definitions and abbreviations
3.1 Terms and definitions
97 3.2 Abbreviations
98 4 Conformance
5 Overview of bonding networks
99 Figure 2 – Schematic of telecommunications equipment distribution and associated bonding connections
100 6 Selection of the telecommunications bonding network approach
6.1 Assessment of the impact of the telecommunications bonding network on the interconnection of telecommunications equipment
Table 2 – Sensitivity of cabling media to bonding network performance
101 Table 3 – Telecommunications bonding network requirements
6.2 Telecommunications bonding networks
102 6.3 Telecommunications bonding network performance
6.3.1 General
6.3.1.1 Protective bonding networks
6.3.1.2 Dedicated telecommunications bonding networks
6.3.2 Requirements
6.3.2.1 General requirements
103 6.3.2.2 Protective bonding networks
Table 4 – DC resistance requirements for protective bonding networks
6.3.2.3 Dedicated bonding networks
Table 5 – DC resistance requirements for dedicated telecommunications bonding networks
6.3.3 DC resistance measurements
6.3.3.1 General
104 6.3.3.2 Dedicated bonding networks
7 Common features
7.1 General
7.2 Protective bonding networks
7.2.1 Protective bonding network conductors (PBNCs)
7.2.2 Main earthing terminal (MET)
7.3 Telecommunications entrance facility (TEF)
105 7.4 Telecommunications bonding network components
7.4.1 Telecommunications bonding network conductors
7.4.1.1 Materials
7.4.1.2 Installation
7.4.2 Telecommunications bonding network connections
106 7.5 Cabinets, frames and racks
7.5.1 External connections to a bonding network
7.5.1.1 Requirements
107 Figure 3 – Example of three methods of equipment and rack bonding
7.5.1.2 Recommendations
7.5.2 Rack bonding conductors
7.5.2.1 Rack bonding conductors for d.c. resistance control
7.5.2.2 Rack bonding conductors (RBC) for impedance control
7.5.2.2.1 Requirements
7.5.2.2.2 Recommendations
108 7.5.3 Internal connections
7.5.3.1 Requirements
Figure 4 – Example of a bond connection from a cabinet to the cabinet door
7.5.3.2 Structural bonding within cabinets, frames and racks
109 7.6 Miscellaneous bonding connections
7.6.1 General
7.6.2 Bonding conductors for d.c. resistance control
7.6.3 Bonding conductors for impedance control
7.6.3.1 Requirements
7.6.3.2 Recommendations
Figure 5 – Example of bonding straps
110 7.7 Documentation
8 Dedicated telecommunications bonding network
8.1 General
111 Figure 6 – Illustrative example of a large building
Figure 7 – Illustrative example of a smaller building
8.2 Components
8.2.1 Primary bonding busbar (PBB)
112 Figure 8 – Schematic of PBB
8.2.2 Secondary bonding busbar (SBB)
Figure 9 – Schematic of SBB
8.2.3 Bonding conductors for d.c. resistance control
8.2.3.1 Telecommunications bonding conductor (TBC)
113 8.2.3.2 Telecommunications bonding backbone (TBB)
8.2.3.2.1 Requirements
8.2.3.2.2 Recommendations
114 Table 6 – TBB conductor sizing
8.2.3.3 Backbone bonding conductor (BBC)
8.2.4 Bonding conductors for impedance control
8.2.4.1 Telecommunications bonding backbone (TBB)
8.2.4.1.1 Requirements
8.2.4.1.2 Recommendations
8.2.4.2 Backbone bonding conductor (BBC)
8.2.4.2.1 Requirements
115 8.2.4.2.2 Recommendations
8.3 Implementation
8.3.1 Primary bonding busbar (PBB)
8.3.1.1 General
8.3.1.2 Bonding to the PBB
116 8.3.2 Secondary bonding busbar (SBB)
8.3.2.1 General
8.3.2.2 Bonding to the secondary bonding busbar
117 8.3.3 Telecommunications bonding conductor (TBC)
8.3.4 Telecommunications bonding backbone (TBB)
8.3.5 Backbone bonding conductor (BBC)
8.3.6 Bonds to continuous conductive pathway systems
8.3.7 Bonds to structural metal
118 9 Local telecommunications bonding networks in conjunction with protective bonding networks
9.1 Bonding for local distribution
9.1.1 Star protective bonding networks
Figure 10 – Star protective bonding and supplementary telecommunications bonding
Figure 11 – Example of high common impedance and large loop
119 Figure 12 – Example of low common impedance and small loop
9.1.2 Ring protective bonding networks
Figure 13 – Ring protective bonding and supplementary telecommunications bonding
120 9.2 Telecommunications bonding conductors
9.2.1 Bonding conductors for d.c. resistance control
9.2.1.1 Requirements
9.2.1.2 Recommendations
Figure 14 – MESH-BN example
121 9.2.2 Bonding conductors for impedance control
9.2.2.1 Requirements
9.2.2.2 Recommendations
9.3 Bonding for areas of telecommunications equipment concentration
10 Local telecommunications bonding networks in conjunction with dedicated telecommunications bonding networks
10.1 Bonding for areas of telecommunications equipment concentration
10.1.1 Requirements
10.1.2 Recommendations
10.1.3 Cabinets, frames and racks
122 10.2 Telecommunications equipment bonding conductors (TEBC)
10.2.1 TEBC for d.c. resistance control
10.2.2 TEBC for impedance control
10.2.2.1 Requirements
10.2.2.2 Recommendations
10.2.3 Implementation
Figure 15 – Example TEBC to rack bonding conductor connection
123 11 Mesh bonded networks
11.1 General
11.2 Mesh bonding alternatives
11.2.1 Local mesh bonding (MESH-IBN) networks
11.2.1.1 General
124 Figure 16 – Local mesh bonding network
Figure 17 – A MESH-IBN having a single point of connection (SPC)
11.2.1.2 Requirements
125 11.2.1.3 Recommendations
11.2.2 MESH-BN
11.2.2.1 General
Figure 18 – A MESH-BN with equipment cabinets, frames, racks and CBN bonded together
11.2.2.2 Requirements
126 11.3 Bonding conductors of a mesh bonding network
11.3.1 Requirements
11.3.2 Recommendations
11.4 Bonding conductors to the mesh bonding network
127 11.5 Supplementary bonding grid (SBG)
11.6 System reference potential plane (SRPP)
11.6.1 General
128 11.6.2 Access floors
11.6.2.1 Requirements
Figure 19 – Example of access floor
11.6.2.2 Recommendations
129 11.6.3 Transient suppression plate (TSP)
Figure 20 – Example of installation details for an under floor transient suppression plate
130 Annex A (normative) Maintenance of telecommunications bonding network performance
A.1 General
A.2 Periodic activity
A.2.1 Schedule
A.2.2 Implementation
A.2.2.1 Protective bonding network
A.2.2.2 Dedicated bonding network
A.2.2.3 Assessment of results
131 A.3 Causes of performance deterioration
A.3.1 Galvanic corrosion
A.3.2 Requirements
132 Bibliography

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