BS EN 60384-24:2006
$142.49
Fixed capacitors for use in electronic equipment – Sectional specification. Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte
Published By | Publication Date | Number of Pages |
BSI | 2006 | 28 |
is applicable to tantalum electrolytic capacitors with conductive polymer solid electrolyte. These capacitors are primarily intended to be mounted direct on to substrates for hybrid circuits or to printed boards. The contents of the corrigendum of October 2006 have been included in this copy.
PDF Catalog
PDF Pages | PDF Title |
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6 | 1 General 1.1 Scope 1.2 Object 1.3 Normative references |
7 | 1.4 Information to be given in a detail specification 1.4.1 Outline drawing and dimensions 1.4.2 Mounting 1.4.3 Rating and characteristics 1.4.3.1 Rated capacitance range 1.4.3.2 Particular characteristics 1.4.3.3 Soldering |
8 | 1.4.4 Marking 1.5 Terms and definitions 1.6 Marking 2 Preferred rating and characteristics 2.1 Preferred characteristics |
9 | 2.1.1 Preferred climatic categories 2.2 Preferred values of ratings 2.2.1 Rated capacitance (CR) 2.2.2 Tolerance on rated capacitance 2.2.3 Rated voltage (UR) 2.2.4 Category voltage (UC) |
10 | 2.2.5 Surge voltage (URS or UCS) 2.2.6 Rated temperature 3 Quality assessment procedures 3.1 Primary stage of manufacture 3.2 Structurally similar components 3.3 Declaration conformity (basic requirements) 3.4 Test schedule and requirement for initial assessment (mandatory and optional tests) 3.4.1 Qualification approval on the basis of the fixed sample size procedures |
11 | 3.4.2 Tests |
19 | 3.5 Quality conformance inspection 3.5.1 Formation of inspection lots 3.5.1.1 Group A and B inspection 3.5.1.2 Group C inspection 3.5.2 The schedule 3.5.3 Delayed delivery 3.5.4 Assessment levels |
20 | 4 Test and measurement procedures 4.1 Preliminary drying |
21 | 4.2 Measuring conditions 4.3 Mounting 4.4 Visual examination and check of dimensions 4.4.1 Visual examination 4.4.2 Requirements 4.5 Electrical tests 4.5.1 Leakage current 4.5.1.1 Measuring condition 4.5.1.2 Requirements 4.5.2 Capacitance 4.5.2.1 Measuring conditions |
22 | 4.5.2.2 Requirements 4.5.3 Tangent of loss angle (tan () 4.5.3.1 Measuring conditions 4.5.3.2 Requirements 4.5.4 Equivalent series resistance (ESR) 4.5.4.1 Measuring condition 4.5.4.2 Requirements 4.6 Resistance to soldering heat 4.6.1 Initial measurement 4.6.2 Test |
23 | 4.6.3 Final inspection, measurements and requirements 4.7 Solderability 4.7.1 Test conditions 4.7.2 Final inspection, measurements and requirements 4.8 Shear test 4.9 Substrate bending test 4.9.1 Initial measurement 4.10 Rapid change of temperature 4.10.1 Initial measurement |
24 | 4.10.2 Test 4.10.3 Final inspection, measurements and requirements 4.11 Climatic sequence 4.11.1 Initial measurement 4.11.2 Dry heat 4.11.3 Damp heat, cyclic, Test Db, first cycle 4.11.4 Cold 4.11.5 Damp heat, cyclic, Test Db, remaining cycles 4.11.5.1 Recovery 4.11.6 Final inspection, measurements and requirements 4.12 Damp heat, steady state 4.12.1 Initial measurement |
25 | 4.12.2 Conditions of test 4.12.3 Final inspection, measurements and requirements 4.13 Characteristics at high and low temperature 4.13.1 Final inspection, measurements and requirements 4.14 Surge 4.14.1 Initial measurement 4.14.2 Test 4.14.3 Final inspection, measurements and requirements 4.15 Endurance 4.15.1 Initial measurement |
26 | 4.15.2 Test 4.15.3 Final inspection, measurements and requirements 4.16 Component solvent resistance (if applicable) 4.17 Solvent resistance of marking (if applicable) 4.18 High surge current (if applicable) 4.19 Storage at high temperature 4.19.1 Initial measurement 4.19.2 Test 4.19.3 Final inspection, measurements and requirements |