BS EN IEC 60749-30:2020
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Semiconductor devices. Mechanical and climatic test methods – Preconditioning of non-hermetic surface mount devices prior to reliability testing
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 18 |
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).
NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore, the temperature at the top of the package on the hottest moisture sensitive SMD during assembly is monitored to ensure that it does not exceed the temperature at which the components are evaluated.
NOTE 2 For the purpose of this document, SMD is restricted to include only plastic-encapsulated SMDs and other packages made with moisture-permeable materials.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
| 7 | English CONTENTS |
| 8 | FOREWORD |
| 10 | 1 Scope 2 Normative references |
| 11 | 3 Terms and definitions 4 General description 5 Test apparatus and materials 5.1 General |
| 12 | 5.2 Moisture chamber 5.3 Solder equipment 5.4 Optical microscope 5.5 Electrical test equipment 5.6 Drying (bake) oven 5.7 Temperature cycle chamber (optional) 6 Procedure 6.1 General |
| 13 | 6.2 Initial measurements 6.2.1 Electrical test 6.2.2 Visual inspection 6.3 Temperature cycling (optional) 6.4 Drying (bake out) 6.5 Soak conditions for dry-packed SMDs 6.5.1 General 6.5.2 Method A for dry-packed SMDs in accordance with IEC 60749-20 6.5.3 Method B for dry-packed SMDs in accordance with IEC 60749‑20 6.6 Soak conditions for non-dry-packed SMDs in accordance with IEC 60749‑20 |
| 14 | 6.7 Solder reflow 6.7.1 Solder reflow procedure 6.7.2 Solder attachment after reflow |
| 15 | 6.8 Flux application simulation (optional) 6.8.1 Flux application 6.8.2 Cleaning and drying after flux application 6.9 Final measurements 6.9.1 Electrical test 6.9.2 Visual inspection 6.10 Applicable reliability tests 7 Summary |
| 16 | Table 1 – Preconditioning sequence flow – Method A (condition A2) in accordance with IEC 60749-20 (dry-packed devices) Table 2 – Preconditioning sequence flow – Method B (conditions B2 to B6) in accordance with IEC 60749-20 (dry-packed devices) |
| 17 | Table 3 – Preconditioning sequence flow – Conditions A1 and B1 in accordance with IEC 60749-20 (non dry-packed devices) |
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BS EN IEC 60749-30:2020
Semiconductor devices. Mechanical and climatic test methods – Preconditioning of non-hermetic surface mount devices prior…
