BSI 12/30262664 DC:2012 Edition
$13.70
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
| Published By | Publication Date | Number of Pages |
| BSI | 2012 | 19 |
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 8 | 1 Scope 1.1 Purpose 2 Normative references 3 Terms and definitions |
| 10 | 4 Symbols, labels, and marks 4.1 Material category symbol 4.1.1 Size and location 4.1.2 Color 4.1.3 Font |
| 11 | 4.2 Second (2nd) level interconnect component label 4.2.1 Color 5 Marking/labeling categories |
| 12 | 5.1 PCB base material categories 5.1.1 Halogen-free base material 5.2 PCB Surface finish categories 5.2.1 Pb-containing 5.2.2 Pb-free 5.3 Second (2nd) level interconnect categories 5.3.1 Pb-containing 5.3.2 Pb-free |
| 13 | 5.4 Conformal coating categories 6 Component marking and labeling 6.1 Component marking 6.2 Lowest level shipping container labeling |
| 14 | 7 PCB/assembly marking and labeling 7.1 PCB marking 7.1.1 PCB shipping container labeling 7.2 Assembly marking 7.2.1 Assembly shipping container labeling 7.3 Solder category marking sequence 7.4 Location 7.5 Size 7.6 Color 7.7 Font 7.8 Method |
| 15 | 7.9 Marking sequence 7.10 Re-marking changes in PCBA materials 8 Marking and/or labeling of pb-containing components, PCBs, and PCB assemblies 8.1 Marking and labeling of components |
| 16 | 8.2 Marking and labeling of PCBs 8.3 Marking and labeling of PCB assemblies 9 Summary of marking and labeling requirements |
| 17 | Annex A (normative)Example alloys and associated material codes |
| 18 | Annex B (normative)Material code flow chart |
