{"id":290947,"date":"2024-10-19T19:44:59","date_gmt":"2024-10-19T19:44:59","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-iso-146062015\/"},"modified":"2024-10-25T16:46:00","modified_gmt":"2024-10-25T16:46:00","slug":"bs-iso-146062015","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-iso-146062015\/","title":{"rendered":"BS ISO 14606:2015"},"content":{"rendered":"
This International Standard gives guidance on the optimization of sputter-depth profiling parameters using appropriate single-layered and multilayered reference materials in order to achieve optimum depth resolution as a function of instrument settings in Auger electron spectroscopy, X-ray photoelectron spectroscopy and secondary ion mass spectrometry.<\/p>\n
This International Standard is not intended to cover the use of special multilayered systems such as delta doped layers.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
6<\/td>\n | Foreword <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | Introduction <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 1\tScope 2\tTerms and definitions <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 3\tSymbols and abbreviated terms 4\tSetting parameters for sputter depth profiling 4.1\tGeneral <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4.2\tAuger electron spectroscopy <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4.3\tX-ray photoelectron spectroscopy 4.4\tSecondary ion mass spectrometry 5\tDepth resolution at an ideally sharp interface in sputter depth profiles 5.1\tMeasurement of depth resolution <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 5.2\tAverage sputtering rate 5.3\tDepth resolution \u2206z <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 6\tProcedures for optimization of parameter settings 6.1\tAlignment of sputtered area with a smaller analysis area 6.1.1\tGeneral <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 6.1.2\tAES 6.1.3\tXPS with a small probe (for example monochromator) 6.1.4\tXPS with a large area source (for example without monochromator) 6.1.5\tSIMS <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 6.2\tOptimization of parameter settings <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Annex\u00a0A (informative) Factors influencing the depth resolution <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Annex\u00a0B (informative) Typical single-layered systems as reference materials <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Annex\u00a0C (informative) Typical multilayered systems used as reference materials <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Annex\u00a0D (informative) Uses of multilayered systems <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Surface chemical analysis. Sputter depth profiling. Optimization using layered systems as reference materials<\/b><\/p>\n |