{"id":424376,"date":"2024-10-20T06:51:26","date_gmt":"2024-10-20T06:51:26","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-23-30469010-dc\/"},"modified":"2024-10-26T12:53:20","modified_gmt":"2024-10-26T12:53:20","slug":"bsi-23-30469010-dc","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-23-30469010-dc\/","title":{"rendered":"BSI 23\/30469010 DC"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 3.4 <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 4 Procedure of thermal circuit network model 4.1 General 4.2 Detailed model analysis <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4.3 Delphi model preparation 4.4 Thermal circuit model topology <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4.5 Determination of thermal capacitance values <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Annex A (normative) Validation for TO-252 case A.1 General A.2 Simulation parameters A.3 Comparison detailed thermal model vs D2elphi model <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" BS EN IEC 63378-3. Thermal standardization on semiconductor packages – Part 3. Thermal circuit simulation models of discrete semiconductor packages for transient analysis<\/b><\/p>\n |