This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit limiters.<\/p>\n
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|---|---|---|---|---|---|---|---|
| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4 Essential ratings and characteristics 4.1 General requirements 4.1.1 Circuit identification and types 4.1.2 General function description 4.1.3 Manufacturing technology 4.1.4 Package identification 4.1.5 Main application <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 4.2 Application description 4.2.1 Conformance to system and\/or interface information 4.2.2 Overall block diagram 4.2.3 Reference data 4.2.4 Electrical compatibility 4.2.5 Associated devices 4.3 Specification of the function 4.3.1 Detailed block diagram \u2013 Functional blocks <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 4.3.2 Identification and function of terminals 4.3.3 Function description Tables Table 1 \u2013 Function of terminals <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 4.4 Limiting values (absolute maximum rating system) 4.4.1 Requirements 4.4.2 Electrical limiting values Table 2 \u2013 Electrical limiting values <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 4.4.3 Temperatures 4.5 Operating conditions (within the specified operating temperature range) 4.6 Electrical characteristics Table 3 \u2013 Electrical limiting values in detail specification Table 4 \u2013 Temperatures <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | 4.7 Mechanical and environmental ratings, characteristics and data 4.8 Additional information Table 5 \u2013 Electrical characteristics <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 5 Measuring methods 5.1 General 5.1.1 General precautions 5.1.2 Characteristic impedance 5.1.3 Handling precautions 5.1.4 Types 5.2 Insertion loss (Lins) 5.2.1 Purpose 5.2.2 Measuring methods <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | Figures Figure 1 \u2013 Circuit diagram for the measurement of the insertion loss (method 1) <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | Figure 2 \u2013 Circuit diagram for the measurement of the scattering parameters <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 5.3 Input return loss (Lret(in)) 5.3.1 Purpose <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 5.3.2 Measuring methods Figure 3 \u2013 Circuit diagram for the measurement of the input return loss (method 1) <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 5.4 Output return loss (Lret(out)) 5.4.1 Purpose 5.4.2 Measuring methods <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | Figure 4 \u2013 Circuit diagram for the measurement of the output return loss (method 1) <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | 5.5 Input power at 1dB compression (Pi(1dB)) and output power at 1dB compression (Po(1dB)) 5.5.1 Purpose 5.5.2 Circuit diagram 5.5.3 Principle of measurement 5.5.4 Circuit description and requirements 5.5.5 Precautions to be observed 5.5.6 Measurement procedure <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | 5.5.7 Specified conditions 5.6 Intermodulation distortion (two-tone)(Pn\/P1) 5.6.1 Purpose 5.6.2 Circuit diagram Figure 5 \u2013 Circuit diagram for the measurement of intermodulation distortion <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | 5.6.3 Principle of measurement 5.6.4 Circuit description and requirements 5.6.5 Precautions to be observed <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | 5.6.6 Measurement procedure 5.6.7 Specified conditions 5.7 Power at the intercept point (for intermodulation products) (Pn(IP)) 5.7.1 Purpose 5.7.2 Circuit diagram 5.7.3 Principle of measurement 5.7.4 Circuit description and requirements 5.7.5 Precautions to be observed <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | 5.7.6 Measurement procedure 5.7.7 Specified conditions 5.8 Leakage power for continuous wave (Pleak(cw)) 5.8.1 Purpose 5.8.2 Circuit diagram <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | 5.8.3 Principle of measurement 5.8.4 Circuit description and requirements 5.8.5 Precautions to be observed 5.8.6 Measurement procedure Figure 6 \u2013 Circuit diagram for the measurement of output leakage power <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | 5.8.7 Specified conditions 5.9 Spike leakage power for pulse wave(Pleak(spike)) and flat leakage power for pulse wave (Pleak(flat)) 5.9.1 Purpose 5.9.2 Circuit diagram 5.9.3 Principle of measurement 5.9.4 Circuit description and requirements 5.9.5 Precautions to be observed 5.9.6 Measurement procedure <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | 5.9.7 Specified conditions 5.10 Response time(tres) 5.10.1 Purpose 5.10.2 Circuit diagram 5.10.3 Principle of measurement Figure 7 \u2013 Circuit diagram for the measurement of response time <\/td>\n<\/tr>\n | ||||||
| 39<\/td>\n | 5.10.4 Circuit description and requirements 5.10.5 Precautions to be observed 5.10.6 Measurement procedure Figure 8 \u2013 Spike leakage voltage and flat leakage voltage vs. time <\/td>\n<\/tr>\n | ||||||
| 40<\/td>\n | 5.10.7 Specified conditions 5.11 Recovery time(trec) 5.11.1 Purpose 5.11.2 Circuit diagram 5.11.3 Principle of measurement Figure 9 \u2013 Circuit diagram for the measurement of recovery time <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | 5.11.4 Circuit description and requirements 5.11.5 Precautions to be observed 5.11.6 Measurement procedure Figure 10 \u2013 Pulse envelope and continuous wave envelope vs. Time <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | 5.11.7 Specified conditions <\/td>\n<\/tr>\n | ||||||
| 43<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices – Microwave integrated circuits. Limiters<\/b><\/p>\n |