BS IEC 62951-5:2019
$102.76
Semiconductor devices. Flexible and stretchable semiconductor devices – Test method for thermal characteristics of flexible materials
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 20 |
IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | English CONTENTS |
| 5 | FOREWORD |
| 7 | 1 Scope 2 Normative references 3 Terms and definitions |
| 8 | 4 Testing method 4.1 General |
| 9 | 4.2 Test apparatus Figures Figure 1 – Thermoreflectance signals of substrate and thin-film materials as functions of temperature Figure 2 – Reflectance vs. temperature of silicon thin-films (thicknesses of1,62 μm, 1,64 μm, and 1,67 μm) for the wavelength of 633 nm |
| 10 | Figure 3 – Schematic of thermoreflectance thermometry with one laser source that is used for calibration |
| 11 | Figure 4 – Schematic of thermoreflectance thermometry with one laser sourcethat is used for measurement |
| 12 | Figure 5 – Schematic of thermoreflectance thermometry with two lasers ofdifferent wavelengths used for calibration |
| 13 | Figure 6 – Schematic of thermoreflectance thermometry with two lasers ofdifferent wavelengths used for measurement |
| 14 | Figure 7 – Optical reflectance of a silicon thin-film (1,526 μm) at 532 nm and 633 nmas a function of temperature Figure 8 – Reflectance ratio of a silicon thin-film as a function of temperature (λ1 = 633 nm and λ2 = 532 nm) |
| 15 | 4.3 Test procedures 4.3.1 General 4.3.2 Substrate specimen Figure 9 – Suspended bending or uniaxial stretching of flexible orstretchable semiconductor materials |
| 16 | 4.3.3 Thin-film specimen 4.4 Report of results |
| 17 | Annex A (informative)Example of 3D design of thermoreflectance thermometry Figure A.1 – 3D design of dual wavelength thermoreflectance setup |
| 18 | Bibliography |
